公开(公告)号：US11483027B2

公开(公告)日：2022-10-25

申请号：US17127017

申请日：2020-12-18

Applicant: California Institute of Technology

Inventor： Adrian J. Tang ,  Mau-Chung Frank Chang ,  Rulin Huang

IPC: H04B1/707 ,  H04B1/712 ,  H04B1/709 ,  H04B1/7087 ,  H04B1/7117

Abstract: We have demonstrated that the bandwidth millimeter wavelengths offer can be leveraged to deeply spread a low-data rate signal below the thermal floor of the environment (sub-thermal) by lowered transmit power combined with free space losses, while still being successfully received through a novel dispreading structure which does not rely on pre-detection to extract timing information. The demonstrated data link ensures that it cannot be detected beyond a designed range from the transmitter, while still providing reliable communication. A demonstration chipset of this sub-thermal concept was implemented in a 28 nm CMOS technology and when combined with an InP receiver was shown to decode signals up to 30 dB below the thermal noise floor by spreading a 9600 bps signal over 1 GHz of RF bandwidth from 93 to 94 GHz using a 64 bit spreading code. The transmitter for this chipset consumed 62 mW while the receiver consumed 281 mw.

公开(公告)号：US20210194535A1

公开(公告)日：2021-06-24

申请号：US17127017

申请日：2020-12-18

Applicant: California Institute of Technology

Inventor： Adrian J. Tang ,  Mau-Chung Frank Chang ,  Rulin Huang

IPC: H04B1/712 ,  H04B1/7117 ,  H04B1/7087 ,  H04B1/709

Abstract: We have demonstrated that the bandwidth millimeter wavelengths offer can be leveraged to deeply spread a low-data rate signal below the thermal floor of the environment (sub-thermal) by lowered transmit power combined with free space losses, while still being successfully received through a novel dispreading structure which does not rely on pre-detection to extract timing information. The demonstrated data link ensures that it cannot be detected beyond a designed range from the transmitter, while still providing reliable communication. A demonstration chipset of this sub-thermal concept was implemented in a 28 nm CMOS technology and when combined with an InP receiver was shown to decode signals up to 30 dB below the thermal noise floor by spreading a 9600 bps signal over 1 GHz of RF bandwidth from 93 to 94 GHz using a 64 bit spreading code. The transmitter for this chipset consumed 62 mW while the receiver consumed 281 mw.