Laser generated surface finishes for implantable medical devices and electrodes

    公开(公告)号:US10112043B2

    公开(公告)日:2018-10-30

    申请号:US15674762

    申请日:2017-08-11

    Abstract: A method of preparing an electrode for use with an implantable medical device, the electrode including a titanium surface, the method including: maintaining a nitrogen gas environment proximate to the titanium surface, delivering energy to a portion of the titanium surface, modifying the portion of the titanium surface with the energy delivered to the titanium surface, and forming titanium nitride by reacting titanium at the portion of the titanium surface with nitrogen from the nitrogen gas environment. Modifying includes increasing a surface area of the portion of the titanium surface, and removing titanium from the portion of the titanium surface. The titanium nitride is formed at the portion of the titanium surface where titanium has been removed.

    Labeled implantable medical devices
    3.
    发明授权
    Labeled implantable medical devices 有权
    标示植入式医疗器械

    公开(公告)号:US09572994B2

    公开(公告)日:2017-02-21

    申请号:US14492863

    申请日:2014-09-22

    Abstract: In general, techniques are described for labeling an implantable medical device (IMD). In one example, an IMD can include a housing including electronic circuitry. The IMD can include a header coupled to the housing and includes a core. The core can define a bore and include a first metal label positioned adjacent to the at least one bore. The IMD includes a lead assembly including at least one lead having a distal end and a proximal end, the at least one lead including a second metal label, the distal end including at least one electrode and the proximal end received within the bore.

    Abstract translation: 通常,描述了用于标记可植入医疗装置(IMD)的技术。 在一个示例中,IMD可以包括包括电子电路的壳体。 IMD可以包括连接到壳体并且包括芯的头部。 芯可以限定孔并且包括邻近于至少一个孔定位的第一金属标签。 IMD包括引线组件,其包括具有远端和近端的至少一个引线,所述至少一个引线包括第二金属标签,所述远端包括容纳在孔内的至少一个电极和近端。

    IMPLANTABLE DEVICE HEADER AND METHOD
    5.
    发明申请
    IMPLANTABLE DEVICE HEADER AND METHOD 审中-公开
    可植入设备头和方法

    公开(公告)号:US20170001021A1

    公开(公告)日:2017-01-05

    申请号:US15206923

    申请日:2016-07-11

    Abstract: Systems and methods for implantable medical devices and headers are described. In an example, an implantable medical device includes a device container including an electronic module within the device container. A modular header core includes a header core module including at least one bore hole configured to receive a lead, an antenna attachment module coupled to the header core, and an antenna engaged with the antenna attachment module. The antenna attachment module is configured to locate the antenna in a selected position with respect to the header core module.

    Abstract translation: 描述了可植入医疗装置和集管的系统和方法。 在一个示例中,可植入医疗装置包括在装置容器内包括电子模块的装置容器。 模块化标头芯包括:头部芯模块,包括配置成接收导线的至少一个钻孔,耦合到所述头芯的天线附接模块以及与所述天线附件模块接合的天线。 天线附接模块被配置为将天线相对于标题核心模块定位在选定的位置。

    Implantable device header and method
    7.
    发明授权
    Implantable device header and method 有权
    可植入设备头和方法

    公开(公告)号:US09387335B2

    公开(公告)日:2016-07-12

    申请号:US13711670

    申请日:2012-12-12

    CPC classification number: A61N1/3752 A61N1/37217 A61N1/375

    Abstract: Systems and methods for implantable medical devices and headers are described. In an example, an implantable medical device includes a device container including an electronic module within the device container. A modular header core includes a first core module including a first bore hole portion of a first bore hole, the first bore hole portion configured to couple a first electrical component with the electronic module. A second core module includes a second bore hole portion of a second bore hole different than the first bore hole, the second bore hole portion configured to couple a second electrical component with the electronic module. The first core module is detachably engaged with the second core module. A header shell is disposed around the modular header core and attached to the device container.

    Abstract translation: 描述了可植入医疗装置和集管的系统和方法。 在一个示例中,可植入医疗装置包括在装置容器内包括电子模块的装置容器。 模块化集管芯包括第一芯模块,其包括第一钻孔的第一钻孔部分,第一钻孔部分被配置为将第一电气部件与电子模块耦合。 第二核心模块包括与第一钻孔不同的第二钻孔的第二钻孔部分,第二钻孔部分被配置为将第二电气部件与电子模块耦合。 第一核心模块可拆卸地与第二核心模块接合。 集管壳体围绕模块化集管芯设置并附接到设备容器。

Patent Agency Ranking