公开(公告)号：US20130032938A1

公开(公告)日：2013-02-07

申请号：US13456293

申请日：2012-04-26

Applicant: Charles W.C. LIN ,  Chia-Chung Wang

Inventor： Charles W.C. LIN ,  Chia-Chung Wang

IPC: H01L23/498

CPC classification number: H01L23/3121 ,  H01L21/56 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A semiconductor assembly board includes a supporting board, a coreless build-up circuitry and a built-in electronic device. The supporting board includes a bump, a flange and a via hole in the bump. The built-in electronic device extends into the via hole and is electrically connected to the build-up circuitry. The build-up circuitry extends from the flange and the built-in electronic device and provides signal routing for the built-in electronic device. The supporting board provides mechanical support, ground/power plane and heat sink for the coreless build-up circuitry.

Abstract translation: 半导体组装板包括支撑板，无芯堆积电路和内置电子设备。 支撑板包括凸块，凸缘和凸块中的通孔。 内置的电子设备延伸到通孔中并电连接到积聚电路。 积聚电路从凸缘和内置电子设备延伸，并为内置电子设备提供信号路由。 支撑板为无芯堆积电路提供机械支撑，接地/电源平面和散热器。

公开(公告)号：US20120129300A1

公开(公告)日：2012-05-24

申请号：US13299495

申请日：2011-11-18

Applicant: Charles W.C. LIN ,  Chia-Chung Wang

Inventor： Charles W.C. LIN ,  Chia-Chung Wang

IPC: H01L21/58

CPC classification number: H01L24/82 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making a stackable semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive, a terminal, a plated through-hole and build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry provides signal routing for the semiconductor device. The plated through-hole provides signal routing between the build-up circuitry and the terminal. The heat spreader provides heat dissipation for the semiconductor device.

Abstract translation: 公开了一种制造包括半导体器件，散热器，粘合剂，端子，电镀通孔和积聚电路的可堆叠半导体组件的方法。 散热器包括凸块，底座和凸缘。 凸块限定一个空腔。 半导体器件安装在空腔处的凸块上，电连接到积聚电路并热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 积聚电路为半导体器件提供信号路由。 电镀通孔在积聚电路和终端之间提供信号路由。 散热器为半导体器件提供散热。

公开(公告)号：US20120129299A1

公开(公告)日：2012-05-24

申请号：US13299472

申请日：2011-11-18

Applicant: Charles W.C. LIN ,  Chia-Chung WANG

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H01L21/60

CPC classification number: H01L24/19 ,  H01L21/4878 ,  H01L23/13 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15321 ,  H01L2924/15323 ,  H01L2924/181 ,  H01L2924/00

Abstract: A method of making a semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive and a build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry includes a dielectric layer and conductive traces on the semiconductor device and the flange. The conductive traces provide signal routing for the semiconductor device.

Abstract translation: 公开了制造包括半导体器件，散热器，粘合剂和积聚电路的半导体组件的方法。 散热器包括凸块，底座和凸缘。 凸块限定一个空腔。 半导体器件安装在空腔处的凸块上，电连接到积聚电路并热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 积聚电路包括介电层和半导体器件上的导电迹线和凸缘。 导电迹线为半导体器件提供信号路由。

公开(公告)号：US20140048324A1

公开(公告)日：2014-02-20

申请号：US13615819

申请日：2012-09-14

Applicant: Charles W.C. LIN ,  Chia Chung WANG

Inventor： Charles W.C. LIN ,  Chia Chung WANG

IPC: H05K1/11

CPC classification number: H01L21/58 ,  H01L23/485 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/12042 ,  H01L2924/15172 ,  H01L2924/171 ,  Y10T428/24917 ,  H01L2924/014 ,  H01L2924/00

Abstract: A hybrid wiring board includes an interposer, a stopper, a stiffener and a build-up circuitry. The stopper is laterally aligned with and laterally extends beyond peripheral edges of the interposer in lateral directions. The interposer extends into an aperture of the stiffener and is electrically connected to the build-up circuitry. The build-up circuitry covers the stopper, the interposer and the stiffener and provides signal routing for the interposer. The stiffener provides mechanical support, ground/power plane and heat sink for the build-up circuitry.

Abstract translation: 混合布线板包括插入件，止动件，加强件和积聚电路。 止动件在横向方向上横向对齐并且横向延伸超过插入件的周边边缘。 插入器延伸到加强件的孔中并且电连接到积聚电路。 积聚电路覆盖止动器，插入器和加强件，并为插入器提供信号路由。 加强筋为建立电路提供机械支撑，接地/电源平面和散热器。

公开(公告)号：US20130032388A1

公开(公告)日：2013-02-07

申请号：US13532941

申请日：2012-06-26

Applicant: Charles W.C. LIN ,  Chia Chung WANG

Inventor： Charles W.C. LIN ,  Chia Chung WANG

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H01L23/3121 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/16 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/3511 ,  Y10T29/49124 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: The present invention relates to a method of making a cavity substrate. The method includes: preparing a supporting board including a stiffener, a bump/flange sacrificial carrier, an adhesive and an electrical pad, wherein the adhesive bonds the stiffener to the sacrificial carrier; forming a coreless build-up circuitry on the supporting board in contact with the bump and the stiffener; and removing the bump to form a cavity and expose the electrical pad from a closed end of the cavity, wherein the cavity is laterally covered and surrounded by the adhesive. A semiconductor device can be mounted on the cavity substrate and electrically connected to the electrical pad. The coreless build-up circuitry provides signal routing for the semiconductor device while the built-in stiffener can provide adequate mechanical support for the coreless build-up circuitry and the semiconductor device.

Abstract translation: 本发明涉及一种制造空腔衬底的方法。 该方法包括：制备包括加强件，凸块/凸缘牺牲载体，粘合剂和电垫的支撑板，其中粘合剂将加强件粘合到牺牲载体上; 在与所述凸块和所述加强件接触的支撑板上形成无芯堆积电路; 并且移除所述凸起以形成空腔并将所述电垫从所述空腔的封闭端露出，其中所述空腔被所述粘合剂横向覆盖并包围。 半导体器件可以安装在空腔衬底上并电连接到电焊盘。 无芯堆积电路为半导体器件提供信号路由，而内置的加强件可为无芯堆积电路和半导体器件提供足够的机械支撑。

公开(公告)号：US20120126401A1

公开(公告)日：2012-05-24

申请号：US13267946

申请日：2011-10-07

Applicant: Charles W.C. LIN ,  Chia-Chung Wang

Inventor： Charles W.C. LIN ,  Chia-Chung Wang

IPC: H01L23/498

CPC classification number: H01L23/3121 ,  H01L21/56 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0207 ,  H05K1/186 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A stackable semiconductor assembly includes a semiconductor device, a heat spreader, an adhesive, a terminal, a plated through-hole and build-up circuitry. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry provides signal routing for the semiconductor device. The plated through-hole provides signal routing between the build-up circuitry and the terminal. The heat spreader provides heat dissipation for the semiconductor device.

Abstract translation: 可堆叠的半导体组件包括半导体器件，散热器，粘合剂，端子，电镀通孔和积聚电路。 散热器包括凸块，底座和凸缘。 凸块限定一个空腔。 半导体器件安装在空腔处的凸块上，电连接到积聚电路并热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 积聚电路为半导体器件提供信号路由。 电镀通孔在积聚电路和终端之间提供信号路由。 散热器为半导体器件提供散热。

公开(公告)号：US20090284932A1

公开(公告)日：2009-11-19

申请号：US12406510

申请日：2009-03-18

Applicant: Charles W.C. LIN

Inventor： Charles W.C. LIN

IPC: H05K7/20

CPC classification number: H01L23/4334 ,  H01L23/3128 ,  H01L23/3677 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention thermally enhanced package with embedded metal slug and patterned circuitry discloses a thermal enhanced package with an embedded metal slug that can be easy directly assembled to the printed circuit board to significantly improve package's thermal dissipation efficiency through the assistance of metal traces in the application board.

Abstract translation: 本发明的具有嵌入式金属块和图案化电路的热增强封装公开了一种具有嵌入式金属块的热增强封装，其可以容易地直接组装到印刷电路板，以通过应用中的金属迹线的帮助显着提高封装的散热效率 板。