Abstract:
A polyester resin composition comprises (A) about 100 parts by weight of polyester resin with a melting point greater than about 200° C. and including repeat units of Formula 1; (B) about 0.1 to about 80 parts by weight of white pigment; and (C) about 0.01 to about 80 parts by weight of filler. The polyester resin composition of the present invention does not exhibit deteriorated reflectance and impact strength and also has good heat resistance, non-yellowing property and humidity resistance and can be used in a light emitting diode (LED) reflector.
Abstract:
A polyamide resin composition comprises (A) about 10 to about 70% by weight of a crystalline polyamide resin, (B) about 10 to about 70% by weight of an amorphous polyamide resin, (C) about 5 to about 30% by weight of an inorganic filler, and (D) about 10 to about 50% by weight of a white pigment. The polyamide resin composition can have good thin-wall moldability, light reflectance, yellowing resistance, impact strength and heat resistance.
Abstract:
The polyester resin composition of the present invention is characterized by comprising: (A) 100 parts by weight of a high heat resistant polyester resin having a main chain formed by a structure derived from aromatic dicarboxylic acid and alicyclic diol, wherein the melting point of the high heat resistant polyester resin is 200° C. or more; (B) 0.1 to 80 parts by weight of white pigment; and (C) 1 to 40 parts by weight of polyolefin copolymer. The resin composition of the present invention further comprises 1 to 40 parts by weight of a high stiffness polyester resin having a main chain comprising a structure derived from aromatic dicarboxylic acid and aliphathic diol. The molding foam, which is obtained from the polyester resin composition and the manufactured polyester resin composition, has good flexibility, heat resistance, and yellowing resistance and can be used for an LED reflecting plate due to having improved impact strength.
Abstract:
A polyamide resin composition comprises (A) about 10 to about 70% by weight of a crystalline polyamide resin, (B) about 10 to about 70% by weight of an amorphous polyamide resin, (C) about 5 to about 30% by weight of an inorganic filler, and (D) about 10 to about 50% by weight of a white pigment. The polyamide resin composition can have good thin-wall moldability, light reflectance, yellowing resistance, impact strength and heat resistance.
Abstract:
A polyester resin composition comprises (A) about 100 parts by weight of polyester resin with a melting point greater than about 200° C. and including repeat units of Formula 1; (B) about 0.1 to about 80 parts by weight of white pigment; and (C) about 0.01 to about 80 parts by weight of filler. The polyester resin composition of the present invention does not exhibit deteriorated reflectance and impact strength and also has good heat resistance, non-yellowing property and humidity resistance and can be used in a light emitting diode (LED) reflector.
Abstract:
The polyester resin composition of the present invention is characterized by comprising: (A) 100 parts by weight of a high heat resistant polyester resin having a main chain formed by a structure derived from aromatic dicarboxylic acid and alicyclic diol, wherein the melting point of the high heat resistant polyester resin is 200° C. or more; (B) 0.1 to 80 parts by weight of white pigment; and (C) 1 to 40 parts by weight of polyolefin copolymer. The resin composition of the present invention further comprises 1 to 40 parts by weight of a high stiffness polyester resin having a main chain comprising a structure derived from aromatic dicarboxylic acid and aliphathic diol. The molding foam, which is obtained from the polyester resin composition and the manufactured polyester resin composition, has good flexibility, heat resistance, and yellowing resistance and can be used for an LED reflecting plate due to having improved impact strength.