公开(公告)号：US20140187686A1

公开(公告)日：2014-07-03

申请号：US14143067

申请日：2013-12-30

Applicant: Cheil Industries Inc.

Inventor： Doo-Young KIM ,  Jung-Hun LEE ,  Jin-Kyung CHO ,  Do-Hoon CHANG ,  Chang-Min HONG

IPC: C08L77/00 ,  C08L71/12

CPC classification number: C08L71/123 ,  C08K5/09 ,  C08K5/092 ,  C08K5/1539 ,  C08L23/06 ,  C08L77/02 ,  C08L77/06

Abstract: A thermoplastic resin composition includes a base resin including (A) about 16 to about 73 wt % of polyphenylene ether; (B) about 18 to about 82 wt % of polyamide; and (C) about 1 to about 20 wt % of a polyethylene-based polymer; (D) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having at least two carboxyl groups and (E) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond, based on about 100 parts by weight of the base resin.

Abstract translation: 热塑性树脂组合物包括基础树脂，其包含（A）约16至约73重量％的聚苯醚; （B）约18-约82重量％的聚酰胺; 和（C）约1至约20重量％的聚乙烯基聚合物; （D）约0.05〜约1重量份的具有至少两个羧基的多官能相容剂和（E）约0.05至约1重量份的具有羧基或酸酐基团的多官能相容剂 以及碳 - 碳双键，基于约100重量份的基础树脂。

公开(公告)号：US20140187703A1

公开(公告)日：2014-07-03

申请号：US14136072

申请日：2013-12-20

Applicant: Cheil Industries Inc.

Inventor： Jae-Youp CHUNG ,  Jung-Hun LEE ,  Do-Hoon CHANG ,  Chang-Min HONG

IPC: C08K7/14 ,  C08K3/16

CPC classification number: C08K7/14 ,  C08K3/16 ,  C08L2201/08 ,  C08L77/06

Abstract: A polyamide resin composition includes (A) a semi-aromatic polyamide resin including a dicarboxylic acid unit including about 40 to about 100 mol % of an aromatic dicarboxylic acid unit, and an aliphatic diamine unit; (B) a glass fiber, and optionally (C) a heat stabilizer including copper halide and/or alkali metal halide, where a content of a terminal carboxyl group [COOH] and a content of a terminal amino group [NH2] of a molecular chain in the semi-aromatic polyamide resin (A) satisfy the following conditions: [COOH]>37 μeq/g; [NH2]>80 μeq/g; and, [NH2]/[COOH]>1.

Abstract translation: 聚酰胺树脂组合物包含（A）包含包含约40至约100摩尔％的芳族二羧酸单元的二羧酸单元和脂族二胺单元的半芳族聚酰胺树脂; （B）玻璃纤维和任选的（C）包含卤化铜和/或碱金属卤化物的热稳定剂，其中末端羧基[COOH]的含量和分子的末端氨基[NH 2]的含量 半芳族聚酰胺树脂（A）中的链条满足以下条件：[COOH]>37μeq/ g; [NH 2]>80μeq/ g; 和[NH 2] / [COOH] 1。