公开(公告)号：US20130180773A1

公开(公告)日：2013-07-18

申请号：US13533702

申请日：2012-06-26

Applicant: Cheng-Feng CHIANG ,  Jung-Chuan CHIANG

Inventor： Cheng-Feng CHIANG ,  Jung-Chuan CHIANG

IPC: H05K1/02 ,  C25D5/02 ,  H05K3/10

CPC classification number: C23C18/1879 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1855 ,  C23C18/1868 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/206 ,  C23C18/285 ,  C23C18/30 ,  C25D5/022 ,  H05K3/182 ,  H05K3/242 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2203/025 ,  H05K2203/107

Abstract: A method for manufacturing circuit substrate structure and its product are provided. Firstly, an attached enhancement portion having rough surfaces is formed on a surface of a carrier through a roughing process, and a catalyst is disposed on a surface of the attached enhancement portion. Finally, a metal layer is formed on the attached enhancement portion after reacting with the catalyst through chemical plating reduction. The foregoing manufacturing method can effectively reduce the usage of the catalyst or an accelerator to greatly decrease the using costs of the catalyst and the accelerator.

Abstract translation: 提供一种制造电路基板结构及其产品的方法。 首先，通过粗加工工艺在载体的表面上形成具有粗糙表面的附着增强部分，并且在附着的增强部分的表面上设置催化剂。 最后，通过化学镀还原在与催化剂反应后，在附着的增强部分上形成金属层。 上述制造方法可以有效地减少催化剂或促进剂的使用，大大降低催化剂和促进剂的使用成本。

公开(公告)号：US20170292928A1

公开(公告)日：2017-10-12

申请号：US15162703

申请日：2016-05-24

Applicant: Cheng-Feng CHIANG ,  Chien-Ying CHIANG ,  Chien-Yi CHIANG

Inventor： Cheng-Feng CHIANG ,  Chien-Ying CHIANG ,  Chien-Yi CHIANG

IPC: G01N27/30 ,  H01R43/16 ,  B21D35/00 ,  G01N27/327 ,  B29C45/14

Abstract: The present invention relates a setting method for a conducting element of an electrochemical test strip and electrochemical test strip thereof. An inspection body is formed by injection molding polymer plastic materials to coat with the plurality of conducting elements, and an external contact surface on an information outputting end of the conducting element is exposed from an inspection slot of the inspection body, so that the information outputting end of the conducting element is extended from the inspection body. Eventually, the information outputting end is bent to fix on a surface of the inspection body. The present invention is not complex and has more precision and convenience, and the manufacturing cost can be reduced efficiently, so that wide application can be expected in the near future.

公开(公告)号：US20110079803A1

公开(公告)日：2011-04-07

申请号：US12574223

申请日：2009-10-06

Applicant: Cheng-Feng CHIANG

Inventor： Cheng-Feng CHIANG

IPC: H01L33/00 ,  H05K1/03

CPC classification number: H01L33/642 ,  H01L23/3677 ,  H01L23/3737 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A carrying structure of semiconductor includes a carrier made of a plastic material with a heat conduction region, each surface of the carrier has an interface layer formed on, and an electrically insulation circuit and a metal layer are defined on the interface layer. The insulation circuit is located on the surface of the heat conduction region and on an encircling annular region extended from two surfaces of the heat conduction region, and at the same time exposing parts of the carrier surface thereby splitting the metal layer on the interface layer into at least two electrodes. A thermal conductor formed in the heat conduction region has a LED chip adhered on it which has at least a contact point connected with the corresponding metal layer with a metal wiring so as to dissipate the heat generated by the chip rapidly with the thermal conductor.

Abstract translation: 半导体的承载结构包括由具有导热区域的塑料材料制成的载体，载体的每个表面都形成有界面层，并且界面层上限定有电绝缘电路和金属层。 绝缘电路位于热传导区域的表面和从导热区域的两个表面延伸的环绕的环形区域上，并且同时使载体表面的部分露出，从而将界面层上的金属层分成 至少两个电极。 形成在导热区域的导热体具有附着在其上的LED芯片，其具有与金属布线至少与相应的金属层连接的接触点，以便用热导体快速散发由芯片产生的热量。

公开(公告)号：US20100294538A1

公开(公告)日：2010-11-25

申请号：US12470759

申请日：2009-05-22

Applicant: Cheng-Feng CHIANG

Inventor： Cheng-Feng CHIANG

IPC: H01B5/14 ,  C25D5/00

CPC classification number: C23C18/1889 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/54 ,  H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A plastic lead frame with reflection and conduction metal layer includes a base made of a metal catalyst containing or an organic substance containing plastic material, the base further includes a slanted reflection surface formed downwardly on top of the base; an insert slot continuously and staggeringly formed along the circumferential fringe of the base; a molded carrier made of non-metallic catalyst or organic substance containing plastic material accommodated in the insert slot; an interface layer formed on the surface of the base by chemical deposition; an insulation route formed on the surface of the base by ablating part of the interface layer with the laser beam radiation; and a metallic layer formed on the base by electroplating process thereby forming a plastic lead frame of excellent electrical conductivity and high light reflection property.

Abstract translation: 具有反射和传导金属层的塑料引线框架包括由含有或含有塑料材料的有机物质的金属催化剂制成的基底，该基底还包括在基底的顶部向下形成的倾斜反射表面; 沿着基部的圆周边缘连续且交错地形成插入槽; 由非金属催化剂制成的模制载体或容纳在插入槽中的含有塑料材料的有机物质; 通过化学沉积形成在基底表面上的界面层; 通过用激光束辐射烧蚀界面层的一部分，形成在基体的表面上的绝缘路线; 以及通过电镀工艺在基底上形成的金属层，从而形成导电性优异，光反射性高的塑料引线框架。

公开(公告)号：US20180200932A1

公开(公告)日：2018-07-19

申请号：US15406669

申请日：2017-01-14

Applicant: Cheng-Feng CHIANG ,  Jung-Chuan CHIANG ,  Wen-Te CHIANG ,  Chien-Ying CHIANG ,  Chien-Yi CHIANG

Inventor： Cheng-Feng CHIANG ,  Jung-Chuan CHIANG ,  Wen-Te CHIANG ,  Chien-Ying CHIANG ,  Chien-Yi CHIANG

IPC: B29C45/00 ,  C25D5/56 ,  G01N27/327 ,  C23C18/31 ,  C23C18/16

CPC classification number: B29C45/0053 ,  B29C2045/0079 ,  B29K2105/0014 ,  B29L2007/007 ,  B29L2009/005 ,  C23C18/1607 ,  C23C18/1641 ,  C23C18/30 ,  C23C18/31 ,  C25D5/56 ,  G01N27/3272

Abstract: The present disclosure illustrates an electrochemical test strip and manufacturing method thereof. In the embodiment, a manufacturing process which is not complex and has well precision and convenience is provided to manufacture the electrochemical test strip for testing human body fluid. A surface metallization layer serves as a conductive signal transmission medium, so that the manufacturing cost can be reduced, and the material can be recovered by dissolving the metal in surface metallization.

公开(公告)号：US20160377570A1

公开(公告)日：2016-12-29

申请号：US14753053

申请日：2015-06-29

Applicant: Cheng-Feng CHIANG ,  Jung-Chuan CHIANG ,  Wen-Te CHIANG ,  Chien-Ying CHIANG ,  Chien-Yi CHIANG

Inventor： Cheng-Feng CHIANG ,  Jung-Chuan CHIANG ,  Wen-Te CHIANG ,  Chien-Ying CHIANG ,  Chien-Yi CHIANG

IPC: G01N27/30

CPC classification number: G01N27/3272 ,  B29C45/14639 ,  B29K2705/00

Abstract: The present invention relates a setting method for a conductive object of electrochemical test strip. In the embodiment, this manufacturing process is not complex, convenient, and has well precision, such that the cost of manufacturing an electrochemical test strip is reduced effectively, the disadvantage of past manufacturing process is improved. The present invention is highly applied and convenient, so that wide application can be expected in the future.

Abstract translation: 本发明涉及电化学测试条的导电物体的设置方法。 在本实施例中，该制造工序不复杂，方便，精度良好，能够有效地降低电化学试片的制造成本，提高了制造工序的缺点。 本发明具有高度的应用和便利性，因此在将来可以广泛应用。

公开(公告)号：US20100307799A1

公开(公告)日：2010-12-09

申请号：US12479791

申请日：2009-06-06

Applicant: Cheng-Feng CHIANG

Inventor： Cheng-Feng CHIANG

IPC: H05K1/03 ,  H05K3/10 ,  H01K3/22

CPC classification number: H05K3/242 ,  H01L33/486 ,  H01L33/60 ,  H01L33/641 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0284 ,  H05K1/183 ,  H05K3/027 ,  H05K3/108 ,  H05K3/181 ,  H05K3/244 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2201/09127 ,  H05K2201/09363 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49158 ,  H01L2924/00

Abstract: A carrier structure for electronic components includes a carrier, an interface layer, insulation paths and a metal layer. The carrier is made of a molded plastic. A reflection cup is formed on the carrier. The carrier is etched, catalyzed and activated, then deposited Ni or Cu by chemical deposition to form an interface layer on it. Afterwards insulation paths are formed on the interface layer by ablating part of the insulation layer employing laser beam radiation, in the followed step, electroplating process is carried out using Cu, Ni, Ag or Au to form a metal layer on the interface layer thereby completing the carrier structure for electronic components.

Abstract translation: 用于电子部件的载体结构包括载体，界面层，绝缘路径和金属层。 载体由模制塑料制成。 在载体上形成反射杯。 载体被蚀刻，催化和活化，然后通过化学沉积沉积Ni或Cu以在其上形成界面层。 之后，通过使用激光束辐射烧蚀绝缘层的一部分，在界面层上形成绝缘路径，在随后的步骤中，使用Cu，Ni，Ag或Au进行电镀工艺，以在界面层上形成金属层，从而完成 电子元件的载体结构。