公开(公告)号：US09999128B2

公开(公告)日：2018-06-12

申请号：US15344217

申请日：2016-11-04

Applicant: Chibitronics Private Limited

Inventor： Andrew Shane Huang ,  Jie Qi

IPC: H05K3/20 ,  H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K3/22 ,  H05K3/46 ,  H01R4/04 ,  H05K3/32

CPC classification number: H05K1/117 ,  C09J9/02 ,  H01R4/04 ,  H05K1/0393 ,  H05K1/092 ,  H05K3/20 ,  H05K3/22 ,  H05K3/321 ,  H05K3/4611 ,  H05K2201/0154 ,  H05K2203/0228 ,  H05K2203/066

Abstract: Electronic sticker technology that enables assembly of circuits at ambient temperature without the use of any special tools.