公开(公告)号：US20080314629A1

公开(公告)日：2008-12-25

申请号：US11960107

申请日：2007-12-19

Applicant: Chih-kuang Yang ,  Cheng-yi Chang

Inventor： Chih-kuang Yang ,  Cheng-yi Chang

IPC: H05K1/02 ,  H05K3/38

CPC classification number: H05K3/28 ,  H05K3/0058 ,  H05K3/381 ,  H05K3/4682 ,  H05K2201/0154 ,  H05K2203/016 ,  H05K2203/065 ,  H05K2203/0759 ,  H05K2203/095 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein.

Abstract translation: 公开了多层基板的多层基板和多层基板的制造方法。 通过使用载体交替地在其上形成介电层和金属结构层。 每个电介质层与相邻的电介质层粘合以将金属结构层嵌入与其对应的电介质层中。 与现有技术相比，当热压和粘附不同材料的不同层时，必须使用预浸料，本发明采用较少的工艺，因此在不使用预浸料的情况下，材料种类较少。 因此，本发明可以提高制造多层基板的整体质量和产率，以满足多层基板的机械特性匹配并降低整个制造工艺的成本。 重要的是，根据本发明的具有薄介电层的多层基板因此可以满足阻抗匹配的关注，并且可以减少串扰影响以保持良好的信号完整性。

公开(公告)号：US20070295970A1

公开(公告)日：2007-12-27

申请号：US11592192

申请日：2006-11-03

Applicant: Cheng-yi Chang

Inventor： Cheng-yi Chang

IPC: H01L33/00 ,  H01L21/58

CPC classification number: H01L33/486 ,  H01L24/16 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A base apparatus includes a base and two finger devices. The base has a first surface and two opposite sides. The finger devices are respectively mounted on the sides of the base, are made of conductive material, and each of the finger devices has multiple fingers. The fingers are extended on the first surface of the base, wherein the fingers of a first finger device are arranged respectively corresponding to the fingers of a second finger device whereby each pair of corresponding fingers supports an illuminating device. The base has a height, each of the fingers has a width and the width is smaller than the height. When the LED is mounted onto a substrate, the LED can be mounted on the substrate by its side so that an entire assembly height of the LED is reduced and is equal to the width of the LED.

Abstract translation: 基本装置包括基座和两个手指装置。 底座具有第一表面和两个相对的两侧。 手指装置分别安装在基座的侧面上，由导电材料制成，并且每个手指装置具有多个指状物。 指状物在基部的第一表面上延伸，其中第一手指装置的指状物分别对应于第二手指装置的手指布置，由此每对相应的手指支撑照明装置。 基座具有高度，每个手指具有宽度，宽度小于高度。 当LED安装到基板上时，LED可以通过其侧面安装在基板上，使得LED的整个组装高度减小并且等于LED的宽度。