公开(公告)号：US20120074857A1

公开(公告)日：2012-03-29

申请号：US13246223

申请日：2011-09-27

Applicant: Ching-Chi CHENG

Inventor： Ching-Chi CHENG

IPC: H05B37/02

CPC classification number: H05B33/0812 ,  H05B33/0845 ,  Y02B20/345

Abstract: A driving circuit for light emitting elements comprises a rectifying unit, a first constant current unit, a first driving transistor, a first voltage control unit and at least one first light emitting element. The rectifying unit has a first terminal and a second terminal, is connected to an external power source that provides alternating current power that is sinusoidal and has alternating negative and positive segments, inverts the negative segments of the AC power to positive segments and forms a pulsating direct current voltage. The first constant current unit has a first end and a second end. The first driving transistor comprises a first gate, a first drain and a first source. The first voltage control unit comprises a first variable resistor and a first bias control element. The first light emitting element has a first end and a second end.

Abstract translation: 用于发光元件的驱动电路包括整流单元，第一恒流单元，第一驱动晶体管，第一电压控制单元和至少一个第一发光元件。 整流单元具有第一端子和第二端子，连接到外部电源，该外部电源提供正弦曲线并且具有交替的负极和正段的交流电力，将交流电源的负段转换为正段并形成脉动 直流电压。 第一恒定电流单元具有第一端和第二端。 第一驱动晶体管包括第一栅极，第一漏极和第一源极。 第一电压控制单元包括第一可变电阻器和第一偏置控制元件。 第一发光元件具有第一端和第二端。

公开(公告)号：US20090261375A1

公开(公告)日：2009-10-22

申请号：US12428342

申请日：2009-04-22

Applicant: Chih-Ming CHEN ,  Deng-Huei HWANG ,  Ching-Chi CHENG

Inventor： Chih-Ming CHEN ,  Deng-Huei HWANG ,  Ching-Chi CHENG

IPC: H01L33/00 ,  G03F7/20 ,  H01L21/768

CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A package-base structure of a luminescent diode and its fabricating process. The package-base structure includes a substrate having thereon a holding space; an insulating layer extending from a bottom surface of the holding space to the bottom of the substrate; an through hole defined in the insulating layer; and a conductive layer disposed over the insulating layer. The insulating layer decouples the current flow and heat flow to increase the lifetime of the package-base structure together with the luminescent diode. In the fabricating process, the insulating layer is formed by anodic etching to allow the insulating layer have a porous structure.

Abstract translation: 发光二极管的封装基础结构及其制造工艺。 封装体结构包括其上具有保持空间的基板; 绝缘层，其从所述保持空间的底表面延伸到所述基板的底部; 绝缘层中限定的通孔; 以及设置在所述绝缘层上的导电层。 绝缘层将电流和热流分离，以增加封装基础结构与发光二极管的寿命。 在制造过程中，通过阳极蚀刻形成绝缘层，以使绝缘层具有多孔结构。