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公开(公告)号：US08476645B2
公开(公告)日：2013-07-02
申请号：US12945052
申请日：2010-11-12
Applicant: Gary A. McDaniel , Chip Akins
Inventor： Gary A. McDaniel , Chip Akins
CPC classification number: F21V29/70 , F21K9/00 , F21V29/004 , F21Y2115/10
Abstract: Thermal management solutions for higher power LEDs. In accordance with embodiments, a heat sink, preferably copper, is connected directly to the thermal pad of an LED. Directly connecting the LED thermal pad to the copper heat sink reduces the thermal resistance between the LED package and the heat sink, and more efficiently conducts heat away from the LED through the copper heat sink. In embodiments, the copper heat sink is directly soldered to the LED thermal pad.
Abstract translation: 高功率LED的热管理解决方案。 根据实施例，散热器（优选铜）直接连接到LED的散热垫。 将LED散热垫直接连接到铜散热片，可以降低LED封装和散热片之间的热阻，更有效地通过铜散热片将LED散热。 在实施例中，铜散热器直接焊接到LED散热垫。
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公开(公告)号：US20110278629A1
公开(公告)日：2011-11-17
申请号：US12945052
申请日：2010-11-12
Applicant: Gary A. McDaniel , Chip Akins
Inventor： Gary A. McDaniel , Chip Akins
IPC: H01L33/64
CPC classification number: F21V29/70 , F21K9/00 , F21V29/004 , F21Y2115/10
Abstract: Thermal management solutions for higher power LEDs. In accordance with embodiments, a heat sink, preferably copper, is connected directly to the thermal pad of an LED. Directly connecting the LED thermal pad to the copper heat sink reduces the thermal resistance between the LED package and the heat sink, and more efficiently conducts heat away from the LED through the copper heat sink. In embodiments, the copper heat sink is directly soldered to the LED thermal pad.
Abstract translation: 高功率LED的热管理解决方案。 根据实施例，散热器（优选铜）直接连接到LED的散热垫。 将LED散热垫直接连接到铜散热片，降低了LED封装和散热片之间的热阻，并且更有效地通过铜散热片将LED散热。 在实施例中，铜散热器直接焊接到LED散热垫。
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公开(公告)号：US08648547B2
公开(公告)日：2014-02-11
申请号：US12942761
申请日：2010-11-09
Applicant: Chip Akins
Inventor： Chip Akins
IPC: G05F1/00 , H05B37/02 , H05B39/04 , H05B41/36 , H05B37/00 , H05B39/00 , H05B41/00 , H01J7/24 , H01J17/28 , H01J13/32 , H01J19/74 , H01J61/52
CPC classification number: H05B33/0812 , Y02B20/343
Abstract: An LED lighting system may include one or more light-emitting diodes and one or more power management modules. Components of the LED lighting system may be selected and arranged, for example, to match a load voltage to an operating voltage. Matching the load voltage to the operating voltage may enable efficient use of power by the LED lighting system. A method of selecting components of the LED lighting system is provided. For example, the components may be selected based on a target luminance and a given operating voltage. The method may be facilitated and/or implemented with a computer.
Abstract translation: LED照明系统可以包括一个或多个发光二极管和一个或多个电源管理模块。 例如，可以选择和布置LED照明系统的组件，以将负载电压与工作电压相匹配。 将负载电压与工作电压相匹配可以有效地利用LED照明系统的功率。 提供了一种选择LED照明系统的部件的方法。 例如，可以基于目标亮度和给定的工作电压来选择组件。 可以利用计算机来促进和/或实现该方法。
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公开(公告)号：US20110109229A1
公开(公告)日：2011-05-12
申请号：US12942761
申请日：2010-11-09
Applicant: Chip Akins
Inventor： Chip Akins
CPC classification number: H05B33/0812 , Y02B20/343
Abstract: An LED lighting system may include one or more light-emitting diodes and one or more power management modules. Components of the LED lighting system may be selected and arranged, for example, to match a load voltage to an operating voltage. Matching the load voltage to the operating voltage may enable efficient use of power by the LED lighting system. A method of selecting components of the LED lighting system is provided. For example, the components may be selected based on a target luminance and a given operating voltage. The method may be facilitated and/or implemented with a computer.
Abstract translation: LED照明系统可以包括一个或多个发光二极管和一个或多个电源管理模块。 例如，可以选择和布置LED照明系统的组件，以将负载电压与工作电压相匹配。 将负载电压与工作电压相匹配可以有效地利用LED照明系统的功率。 提供了一种选择LED照明系统的部件的方法。 例如，可以基于目标亮度和给定的工作电压来选择组件。 可以利用计算机来促进和/或实现该方法。
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