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Patent Agency Ranking
公开(公告)号：US08188373B2
公开(公告)日：2012-05-29
申请号：US12329488
申请日：2008-12-05
Applicant: Christopher A. Hunrath
Inventor： Christopher A. Hunrath
IPC: H05K1/09
CPC classification number: H05K1/09 , H05K1/0271 , H05K3/025 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4682 , H05K3/4688 , H05K2201/0154 , H05K2201/0195 , H05K2201/0355 , H05K2203/0152 , H05K2203/1536 , Y10T29/4913 , Y10T156/10 , Y10T428/31678 , Y10T428/31721
Abstract: One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.
Abstract translation: 本文包含的一个或多个实施方案公开了刚性印刷电路板（PCB）及其制造方法，其包括抗应变层，其特征在于，最小化PCB中盖层中发生的缺陷。
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公开(公告)号：US20130062099A1
公开(公告)日：2013-03-14
申请号：US13571229
申请日：2012-08-09
Applicant: Christopher A. Hunrath
Inventor： Christopher A. Hunrath
CPC classification number: H05K3/462 , H05K3/4069 , H05K2203/0152 , H05K2203/1545 , Y10T29/49155
Abstract: A multiple layered apparatus and method for forming a z-axis interconnect is provided. The multiple layered apparatus comprises a protective layer, a dielectric layer, a conductive layer, and a support layer. A method for forming a z-axis interconnect using the multiple layer apparatus resulting in a thinner and less expensive structure for printed circuit board applications.
Abstract translation: 提供了一种用于形成z轴互连的多层设备和方法。 多层设备包括保护层，电介质层，导电层和支撑层。 使用多层设备形成z轴互连的方法导致用于印刷电路板应用的较薄且较便宜的结构。
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公开(公告)号：US20120227258A1
公开(公告)日：2012-09-13
申请号：US13478026
申请日：2012-05-22
Applicant: Christopher A. Hunrath
Inventor： Christopher A. Hunrath
CPC classification number: H05K1/09 , H05K1/0271 , H05K3/025 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4682 , H05K3/4688 , H05K2201/0154 , H05K2201/0195 , H05K2201/0355 , H05K2203/0152 , H05K2203/1536 , Y10T29/4913 , Y10T156/10 , Y10T428/31678 , Y10T428/31721
Abstract: One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.
Abstract translation: 本文包含的一个或多个实施方案公开了刚性印刷电路板（PCB）及其制造方法，其包括抗应变层，其特征在于，最小化PCB中盖层中发生的缺陷。
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公开(公告)号：US20120141753A1
公开(公告)日：2012-06-07
申请号：US13309513
申请日：2011-12-01
Applicant: Christopher A. Hunrath
Inventor： Christopher A. Hunrath
IPC: C09J7/02 , B32B15/08 , C09J139/04
CPC classification number: C09J171/00 , B32B7/12 , B32B27/36 , B32B2457/08 , C08G2650/56 , C08L61/06 , C08L71/00 , C08L79/00 , C09J7/25 , C09J7/29 , C09J179/04 , C09J2203/326 , C09J2400/163 , C09J2463/00 , C09J2467/006 , C09J2479/00 , C09J2479/086 , H01L21/48 , H01L23/145 , H01L23/49822 , H01L2924/0002 , H05K3/4655 , H05K2201/0154 , H05K2201/029 , Y10T428/24942 , Y10T428/2848 , Y10T428/2852 , Y10T428/31678 , H01L2924/00
Abstract: One or more embodiments contained herein disclose an adhesive layer for printed circuit board (PCB) applications. The improved adhesive film layer may comprise a benzoxazine resin and a phenoxy resin. According to some embodiments, the improved adhesive film layer may be coated onto a polyester release sheet.
Abstract translation: 本文包含的一个或多个实施方案公开了用于印刷电路板（PCB）应用的粘合剂层。 改进的粘合剂膜层可以包含苯并恶嗪树脂和苯氧基树脂。 根据一些实施例，改进的粘合剂膜层可以涂覆在聚酯剥离片上。
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公开(公告)号：US20090151989A1
公开(公告)日：2009-06-18
申请号：US12329488
申请日：2008-12-05
Applicant: Christopher A. Hunrath
Inventor： Christopher A. Hunrath
CPC classification number: H05K1/09 , H05K1/0271 , H05K3/025 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4682 , H05K3/4688 , H05K2201/0154 , H05K2201/0195 , H05K2201/0355 , H05K2203/0152 , H05K2203/1536 , Y10T29/4913 , Y10T156/10 , Y10T428/31678 , Y10T428/31721
Abstract: One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.
Abstract translation: 本文包含的一个或多个实施方案公开了刚性印刷电路板（PCB）及其制造方法，其包括抗应变层，其特征在于，最小化PCB中盖层中发生的缺陷。
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