Abstract:
A circuit layer manufacturing method is applied to a portable computer. The portable computer includes a front bezel, a display module, and a back cover. The front bezel is connected to the back cover for containing the display module. The front bezel includes a metal portion. The metal portion has a flat region corresponding to a side of the back cover. The circuit layer manufacturing method includes forming at least one control circuit layer assembly on the flat region, grounding the control circuit layer assembly to the flat region, and forming a protection layer on the control circuit layer assembly. The control circuit layer assembly includes an insulation layer and a control circuit layer. The control circuit layer is electrically connected to the display module. The insulation layer is formed between the control circuit layer and the flat region for being alternately stacked with the control circuit layer.
Abstract:
A circuit layer manufacturing method is applied to a portable computer. The portable computer includes a front bezel, a display module, and a back cover. The front bezel is connected to the back cover for containing the display module. The front bezel includes a metal portion. The metal portion has a flat region corresponding to a side of the back cover. The circuit layer manufacturing method includes forming at least one control circuit layer assembly on the flat region, grounding the control circuit layer assembly to the flat region, and forming a protection layer on the control circuit layer assembly. The control circuit layer assembly includes an insulation layer and a control circuit layer. The control circuit layer is electrically connected to the display module. The insulation layer is formed between the control circuit layer and the flat region for being alternately stacked with the control circuit layer.