公开(公告)号：US07665648B2

公开(公告)日：2010-02-23

申请号：US11858837

申请日：2007-09-20

Applicant: Chun-Chieh Pan

Inventor： Chun-Chieh Pan

IPC: B23K31/02

CPC classification number: H01L24/73 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/14104 ,  H01L2224/16237 ,  H01L2224/17104 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A fabrication method and structure for a PCBA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing at least one first pad and a plurality of second pads arranged beyond the first pad, on a surface. The first solder joint has a maximum width J1 and electrically connects to the first pad. The second solder joints respectively have a maximum width J2 exceeding J1 and respectively electrically connect to the second pads. The electronic device has a plurality of third pads, arranged substantially corresponding to the openings, respectively electrically connecting to the first pad and second pads.

Abstract translation: PCBA的制造方法和结构，以及用于组装结构的工具。 该结构包括电路板，至少一个第一焊接接头，多个第二焊点和电子器件。 电路板具有焊接掩模，其具有在表面上暴露至少一个第一焊盘和布置成超过第一焊盘的多个第二焊盘的多个开口。 第一焊点具有最大宽度J1并且电连接到第一焊盘。 第二焊点分别具有超过J1的最大宽度J2并分别电连接到第二焊盘。 电子设备具有多个第三焊盘，其大致对应于开口分别电连接到第一焊盘和第二焊盘。

公开(公告)号：US20080245554A1

公开(公告)日：2008-10-09

申请号：US12140973

申请日：2008-06-17

Applicant: Chun-Chieh Pan

Inventor： Chun-Chieh Pan

IPC: H05K1/16 ,  H05K7/08 ,  H05K3/34

CPC classification number: H01L24/73 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/14104 ,  H01L2224/16237 ,  H01L2224/17104 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A fabrication method and structure for a PBCA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing at least one first pad and a plurality of second pads arranged beyond the first pad, on a surface. The first solder joint has a maximum width J1 and electrically connects to the first pad. The second solder joints respectively have a maximum width J2 exceeding J1 and respectively electrically connect to the second pads. The electronic device has a plurality of third pads, arranged substantially corresponding to the openings, respectively electrically connecting to the first pad and second pads.

公开(公告)号：US07307221B2

公开(公告)日：2007-12-11

申请号：US11100005

申请日：2005-04-05

Applicant: Chun-Chieh Pan

Inventor： Chun-Chieh Pan

IPC: H05K1/16

CPC classification number: H01L24/73 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/14104 ,  H01L2224/16237 ,  H01L2224/17104 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A fabrication method and structure for a PCBA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing at least one first pad and a plurality of second pads arranged beyond the first pad, on a surface. The first solder joint has a maximum width J1 and electrically connects to the first pad. The second solder joints respectively have a maximum width J2 exceeding J1 and respectively electrically connect to the second pads. The electronic device has a plurality of third pads, arranged substantially corresponding to the openings, respectively electrically connecting to the first pad and second pads.

Abstract translation: PCBA的制造方法和结构，以及用于组装结构的工具。 该结构包括电路板，至少一个第一焊接接头，多个第二焊点和电子器件。 电路板具有焊接掩模，其具有在表面上暴露至少一个第一焊盘和布置成超过第一焊盘的多个第二焊盘的多个开口。 第一焊点具有最大宽度J 1并且电连接到第一焊盘。 第二焊点分别具有超过J 1的最大宽度J 2并且分别电连接到第二焊盘。 电子设备具有多个第三焊盘，其大致对应于开口分别电连接到第一焊盘和第二焊盘。

公开(公告)号：US20050217894A1

公开(公告)日：2005-10-06

申请号：US11100005

申请日：2005-04-05

Applicant: Chun-Chieh Pan

Inventor： Chun-Chieh Pan

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H05K3/34

CPC classification number: H01L24/73 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/14104 ,  H01L2224/16237 ,  H01L2224/17104 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A fabrication method and structure for a PBCA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing at least one first pad and a plurality of second pads arranged beyond the first pad, on a surface. The first solder joint has a maximum width J1 and electrically connects to the first pad. The second solder joints respectively have a maximum width J2 exceeding J1 and respectively electrically connect to the second pads. The electronic device has a plurality of third pads, arranged substantially corresponding to the openings, respectively electrically connecting to the first pad and second pads.

Abstract translation: 一种PBCA的制造方法和结构，以及该结构的装配工具。 该结构包括电路板，至少一个第一焊接接头，多个第二焊点和电子器件。 电路板具有焊接掩模，其具有在表面上暴露至少一个第一焊盘和布置成超过第一焊盘的多个第二焊盘的多个开口。 第一焊点具有最大宽度J 1和电连接到第一焊盘。 第二焊点分别具有超过J 1的最大宽度J 2，并且分别电连接到第二焊盘。 电子设备具有多个第三焊盘，其大致对应于开口分别电连接到第一焊盘和第二焊盘。