公开(公告)号：US20130263780A1

公开(公告)日：2013-10-10

申请号：US13859171

申请日：2013-04-09

Applicant: Cicor Management AG

Inventor： Ernst Feurer ,  Bruno Holl ,  Alexander Kaiser ,  Karin Ruess

IPC: H05K3/00

CPC classification number: H05K3/00 ,  H05K3/007 ,  H05K2201/0154 ,  H05K2203/0169 ,  H05K2203/0271 ,  Y10S269/90 ,  Y10S269/903

Abstract: A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.

Abstract translation: 规定了用于生产柔性电路配置的方法，其允许以高精度和高精度地在载体膜上制造这种柔性电路。 为此目的，载体膜在方法开始时被紧固在刚性框架上，刚性框架包围内部区域，并且使用内表面跨越内部区域。 在完成层结构和可选地附加的方法步骤之后，可以通过将柔性电路配置从内表面切割为切口来容易地切割在内表面上形成的用于柔性电路配置的结构。 通过将载体膜紧固在框架上，在制造柔性电路结构的各种方法步骤期间确保了柔性本身的载体膜总是形成用于各种方法措施的水平基础 特别是层结构的层的光刻结构。

公开(公告)号：US08915489B2

公开(公告)日：2014-12-23

申请号：US13859171

申请日：2013-04-09

Applicant: Cicor Management AG

Inventor： Ernst Feurer ,  Bruno Holli ,  Alexander Kaiser ,  Karin Ruess

IPC: H01L21/687 ,  H05K3/00

CPC classification number: H05K3/00 ,  H05K3/007 ,  H05K2201/0154 ,  H05K2203/0169 ,  H05K2203/0271 ,  Y10S269/90 ,  Y10S269/903

Abstract: A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.

Abstract translation: 规定了用于生产柔性电路配置的方法，其允许以高精度和高精度地在载体膜上制造这种柔性电路。 为此目的，载体膜在方法开始时被紧固在刚性框架上，刚性框架包围内部区域，并且使用内表面跨越内部区域。 在完成层结构和可选地附加的方法步骤之后，可以通过将柔性电路配置从内表面切割为切口来容易地切割在内表面上形成的用于柔性电路配置的结构。 通过将载体膜紧固在框架上，在制造柔性电路结构的各种方法步骤期间确保了柔性本身的载体膜总是形成用于各种方法措施的水平基础 特别是层结构的层的光刻结构。

公开(公告)号：US20150289373A1

公开(公告)日：2015-10-08

申请号：US14687644

申请日：2015-04-15

Applicant: Cicor Management AG

Inventor： Ernst Feurer ,  Bruno Holli ,  Alexander Kaiser ,  Karin Ruess

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/421 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts.

Abstract translation: 为了生产包含层序列和连接到其上的膜的柔性电路配置，为了通过膜到达层序列的端子表面产生通过触点的通孔，建议将膜非结构化地连接到层 序列提供在衬底上的限定位置，然后当层序列和膜的复合物保留在衬底上时，通过膜形成通孔，直到层序列的导电层的端子表面，并将接触金属沉积在结构化 在电影和穿孔中形成通过接触。