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公开(公告)号：US11879620B2
公开(公告)日：2024-01-23
申请号：US17476736
申请日：2021-09-16
Applicant: Ciena Corporation
Inventor： Victor Aldea , Michael Ledwinka , Trevor Meunier
IPC: F21V23/00 , H05K3/30 , F21V8/00 , F21Y115/10
CPC classification number: F21V23/005 , G02B6/0073 , H05K3/303 , F21Y2115/10 , H05K2201/10106 , H05K2201/10121
Abstract: A combination standoff and LED includes a surface mount solder standoff which can be either threaded or unthreaded, and a surface mount LED disposed and fixed in the center of the base of the standoff. The combination standoff and LED is adapted to receive a lightpipe via the either threaded or unthreaded portion of the surface mount solder standoff. This combination standoff and LED results in a single piece of hardware which simplifies the physical PCBA layout design and removes any Computer Aided Design (CAD) placement errors that would normally be present if two separate hardware components were placed together manually.
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公开(公告)号：US20230318712A1
公开(公告)日：2023-10-05
申请号：US17712263
申请日：2022-04-04
Applicant: Ciena Corporation
Inventor： Michael Hubbard , Will Leckie , Victor Aldea , Priyanth Mehta
CPC classification number: H04B10/5051 , H04B10/615 , H04B10/616
Abstract: A coherent optical transmitter includes circuitry connected to a coherent modulator; and a plurality of tunable optical filters (TOFs) connected to one another and connected to an output of the coherent modulator, wherein the plurality of tunable optical filters are configurable to create an effective transfer function having a variable width. The TOFs are cascaded and can be included in discrete form on electro-optic printed circuit boards (PCBs), or integrated in various electro-optic material systems such as in silicon photonics, photonic integrated circuits (PICs), as well as hybrid and other approaches. The advantage of this approach includes improved OSNR in colorless transmitters.
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公开(公告)号：US10062993B1
公开(公告)日：2018-08-28
申请号：US15588876
申请日：2017-05-08
Applicant: Ciena Corporation
Inventor： Arkadiusz Eric Lutkiewicz , Victor Aldea
CPC classification number: H01R12/721 , H01R12/62
Abstract: A circuit assembly is disclosed. The circuit assembly includes an edge connector comprising a plurality of connector pins for electrical connection, a rigid circuit board comprising a connector footprint region, wherein the connector footprint region is mechanically coupled to the plurality of connector pins, and a flexible cable comprising a first edge connection component, wherein the flexible cable is inserted in-between the connector footprint region and at least a portion of the plurality of connector pins, wherein the first edge connection component is electrically connected to at least one of the plurality of connector pins.
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公开(公告)号：US20250168963A1
公开(公告)日：2025-05-22
申请号：US19033779
申请日：2025-01-22
Applicant: Ciena Corporation
Inventor： Mitchell O'Leary , Victor Aldea , Kamran Rahmani , Trevor Meunier , Peter Ajersch , Terence Graham , Marc Leclair
Abstract: A module for use in a hardware platform for networking, computing, or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side has greater vertical clearance than the secondary side; at least one component mounted on the secondary side, the at least one component being placed on the secondary side due to an increased complexity and component density on the printed circuit board assembly preventing its placement on the primary side; and a floating heatsink assembly disposed on the secondary side to dissipate heat from the at least one component, the floating heatsink assembly being biased against the at least one component by at least one resilient member arranged within a limited vertical space on the secondary side.
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公开(公告)号：US20220352651A1
公开(公告)日：2022-11-03
申请号：US17761036
申请日：2020-09-09
Applicant: Ciena Corporation
Inventor： Mitchell O'Leary , Victor Aldea , Kamran Rahmani , Trevor Meunier , Peter Ajersch , Terence Graham , Marc Leclair
Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20200271877A1
公开(公告)日：2020-08-27
申请号：US16287266
申请日：2019-02-27
Applicant: Ciena Corporation
Inventor： Eric Maniloff , Victor Aldea , Terence Graham , Bonnie Lynne Mack
IPC: G02B6/42
Abstract: The present disclosure provides pluggable optical modules that are prevented from reaching potentially dangerous temperatures when a fiber optic connector is not present and engaged with the associated module housing. Further, the present disclosure provides fiber optic connectors and/or pluggable optical modules that incorporate a port heat shield external to the associated face plate when the pluggable optical modules and fiber optic connectors are engaged, thereby preventing a user from contacting potentially hot and dangerous metallic surfaces of the module housings, as well as providing access for cooling air flow. The solutions presented herein are equally applicable to fixed optical ports and connectors as well.
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7.发明申请公开(公告)号：US20200257067A1
公开(公告)日：2020-08-13
申请号：US16271081
申请日：2019-02-08
Applicant: Ciena Corporation
Inventor： Trevor Meunier , Mitchell O'Leary , Victor Aldea , Kamran Rahmani
Abstract: A heatsink for pluggable optical devices that incorporates features to limit the travel and deformation of the mating/mated spring clip that holds the heatsink to the cage of a pluggable optical device. The heatsink bearing surface takes the shape and contour of the leaf spring portion of the spring clip, thereby contacting and supporting it well before it plastically yields and permanently deforms. The shape of this feature, which may be coupled to or integrally formed with the heatsink bearing surface, can match exactly the shape of the spring clip or approximate the shape using a curved, variable, or other easier to manufacture profile, as long as the associated protrusions extend up into the corners of the leaf spring portion of the spring clip. This feature effectively acts as a hard stop and prevents the spring clip from being compromised due to improper handling or installation.
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公开(公告)号：US12288954B2
公开(公告)日：2025-04-29
申请号：US17761036
申请日：2020-09-09
Applicant: Ciena Corporation
Inventor： Mitchell O'Leary , Victor Aldea , Kamran Rahmani , Trevor Meunier , Peter Ajersch , Terence Graham , Marc Leclair
Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.
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公开(公告)号：US11378757B1
公开(公告)日：2022-07-05
申请号：US17124570
申请日：2020-12-17
Applicant: Ciena Corporation
Inventor： Mitchell O'Leary , Yannick Brisebois , Victor Aldea , Trevor Meunier , Kamran Rahmani
IPC: G02B6/38
Abstract: An optical fiber connector of a networking module faceplate assembly includes a shuttle body, a connection assembly, and a retention clip. The shuttle body including a fiber slot extending across the shuttle body and adapted for an optical fiber to extend therethrough. The connection assembly is adapted to connect the optical fiber of the networking module to an external optical fiber connector. The connection assembly includes a ferrule flange fiber termination, a split sleeve, and a ferrule. The ferrule flange fiber termination positioned within the shuttle body and adapted to splice to an end of the optical fiber. A length of the optical fiber connector can be less than half a length of the external optical fiber connector.
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公开(公告)号：US10509180B2
公开(公告)日：2019-12-17
申请号：US15891449
申请日：2018-02-08
Applicant: Ciena Corporation
Inventor： Trevor Meunier , Mitchell O'Leary , Victor Aldea
Abstract: A fiber tray with an adjustable fiber boot exit angle includes one or more trays each including a base layer and a retention mechanism for one or more optical fibers at various positions about the base layer, wherein the one or more trays provide management of the one or more optical fibers in a fiber optic assembly; a fiber boot at an exit point of a tray of the one or more trays, wherein the fiber boot provides an exit for the one or more optical fibers from the fiber tray; and an adjustment mechanism configured to adjust an exit angle of the one or more optical fibers by changing position of the fiber boot, wherein the exit angle is set based on a type of the fiber optic assembly.
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