公开(公告)号：US11473860B2

公开(公告)日：2022-10-18

申请号：US16851021

申请日：2020-04-16

Applicant: CoolIT Systems, Inc.

Inventor： Mike Holden ,  Kamal Mostafavi ,  Randy Kubik

IPC: F28F27/00 ,  G01M3/16 ,  H05K7/20

Abstract: In some respects, concepts disclosed herein generally concern systems, methods and components to detect a presence of a liquid externally of a desired primary flow path through a segment of a fluid circuit, e.g., throughout a cooling loop. Some disclosed concepts pertain to systems, methods, and components to direct seepage or leakage of a liquid coolant toward a lead-detection sensor. As but one example, some disclosed liquid-cooled heat exchangers incorporate a leak-detection sensor, which, in turn, can couple with a computing environment that monitors for detected leaks, and, responsive to an indication of a detected leak, invokes a task to control or to mitigate the detected leak.

公开(公告)号：US20200340767A1

公开(公告)日：2020-10-29

申请号：US16851021

申请日：2020-04-16

Applicant: CoolIT Systems, Inc.

Inventor： Mike Holden ,  Kamal Mostafavi ,  Randy Kubik

IPC: F28F27/00 ,  G01M3/16 ,  H05K7/20

Abstract: In some respects, concepts disclosed herein generally concern systems, methods and components to detect a presence of a liquid externally of a desired primary flow path through a segment of a fluid circuit, e.g., throughout a cooling loop. Some disclosed concepts pertain to systems, methods, and components to direct seepage or leakage of a liquid coolant toward a lead-detection sensor. As but one example, some disclosed liquid-cooled heat exchangers incorporate a leak-detection sensor, which, in turn, can couple with a computing environment that monitors for detected leaks, and, responsive to an indication of a detected leak, invokes a task to control or to mitigate the detected leak.

公开(公告)号：US11924996B2

公开(公告)日：2024-03-05

申请号：US17201394

申请日：2021-03-15

Applicant: CoolIT Systems, Inc.

Inventor： Brad Zakaib ,  Kamal Mostafavi ,  Jarod Domingo ,  Yixuan Gao

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20272 ,  H05K7/20409

Abstract: A heat exchanger for a liquid cooling system has an enclosure defining an internal chamber and a wall defining an external major surface of the enclosure. The enclosure extends from a first open end to an opposed second open end and an inlet passage extends from the first open end to the internal chamber. An outlet passage extends from the internal chamber to the second open end. A plurality of corrugated fins are conductively coupled with the wall defining the external major surface and positioned in the internal chamber. A liquid cooling system can include such a heat exchanger. And, an electronic device can include one or more multichip modules cooled by such a cooling system.

公开(公告)号：US20220104395A1

公开(公告)日：2022-03-31

申请号：US17201394

申请日：2021-03-15

Applicant: CoolIT Systems, Inc.

Inventor： Brad Zakaib ,  Kamal Mostafavi ,  Jarod Domingo ,  Yixuan Gao

IPC: H05K7/20

Abstract: A heat exchanger for a liquid cooling system has an enclosure defining an internal chamber and a wall defining an external major surface of the enclosure. The enclosure extends from a first open end to an opposed second open end and an inlet passage extends from the first open end to the internal chamber. An outlet passage extends from the internal chamber to the second open end. A plurality of corrugated fins are conductively coupled with the wall defining the external major surface and positioned in the internal chamber. A liquid cooling system can include such a heat exchanger. And, an electronic device can include one or more multichip modules cooled by such a cooling system.