公开(公告)号：US12114457B2

公开(公告)日：2024-10-08

申请号：US17579522

申请日：2022-01-19

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Hsin-Hung Chen ,  Jui-Tse Yin

IPC: H05K7/14 ,  G06F1/18 ,  G06F1/20 ,  H05K5/00

CPC classification number: H05K7/1432 ,  G06F1/189 ,  G06F1/20 ,  H05K5/0004

Abstract: A modular power supply is disclosed. The modular power supply includes a power supply unit and an expansion unit. The expansion unit is detachably disposed on the power supply unit and located on one side of the power supply unit in a thickness direction of the modular power supply.

公开(公告)号：US20250081417A1

公开(公告)日：2025-03-06

申请号：US18458103

申请日：2023-08-29

Applicant: Cooler Master Technology Inc.

Inventor： I-Chia Lee ,  Jen-Chih CHENG ,  Jui-Tse Yin

IPC: H05K7/20 ,  G06F1/18 ,  G06F1/20 ,  H05K7/14

Abstract: A computer power supply unit including a housing, a main board disposed in the housing, at least one high heat producing component disposed on the main board, at least one other heat producing component disposed on the main board, and a heat transfer system is provided. The heat transfer system comprises bottom and top heat transfer devices. Thermal paths are formed between the bottom heat transfer device and a bottom panel of the housing and the top heat transfer device and a top panel of the housing to dissipate heat from an at least one high heat component assembly, formed in part by the at least one high heat producing component, and an at least one other heat component assembly, formed in part by the at least one other heat producing component, to an outside of the bottom panel and an outside of the top panel.