公开(公告)号：US20150192923A1

公开(公告)日：2015-07-09

申请号：US14415414

申请日：2013-07-16

Applicant: Cornell University

Inventor： Fnu Apoorva ,  Robert MacCurdy ,  Hod Lipson

IPC: G05B19/418

CPC classification number: G05B19/4189 ,  B81C99/002

Abstract: A system based on electrowetting facilitates high-volume assembly of objects including micron sized objects. A material handling component of the system includes an array of electrically controlled nodes that switch their adhesion property based on a voltage supply. The system accurately picks up and places objects including in parallel.

Abstract translation: 基于电润湿的系统有助于大量组装物体，包括微米尺寸的物体。 该系统的材料处理部件包括电控节点阵列，其基于电压源切换其粘附性质。 系统准确地拾取并放置包括并行的对象。