公开(公告)号：US20190127262A1

公开(公告)日：2019-05-02

申请号：US15749245

申请日：2016-07-29

Applicant: Corning Precision Materials Co., Ltd.

Inventor： Sang Jin Hong ,  Joon-Soo Kim ,  Sang Yoon Oh ,  Dong Keun Shin ,  Min Soo Song

IPC: C03B33/07 ,  C03B33/03 ,  C03B33/033 ,  C03B33/027 ,  B24B7/24

Abstract: A method and apparatus for cutting a glass laminate. A trench line is formed in a glass substrate that is an uppermost layer of a glass laminate by scoring a surface of the glass substrate. The glass laminate is cut in the direction parallel to the trench line. It is possible to prevent the propagation of cracks commonly formed during the cutting of glass laminates.

公开(公告)号：US10737968B2

公开(公告)日：2020-08-11

申请号：US15749245

申请日：2016-07-29

Applicant: Corning Precision Materials Co., Ltd.

Inventor： Sang Jin Hong ,  Joon-Soo Kim ,  Sang Yoon Oh ,  Dong Keun Shin ,  Min Soo Song

IPC: B24B7/24 ,  C03B33/07 ,  C03B33/02 ,  C03B33/027 ,  C03B33/03 ,  C03B33/033

Abstract: A method and apparatus for cutting a glass laminate. A trench line is formed in a glass substrate that is an uppermost layer of a glass laminate by scoring a surface of the glass substrate. The glass laminate is cut in the direction parallel to the trench line. It is possible to prevent the propagation of cracks commonly formed during the cutting of glass laminates.