公开(公告)号：US20020135981A1

公开(公告)日：2002-09-26

申请号：US10118279

申请日：2002-04-08

Applicant: Cray Inc.

Inventor： Gregory W. Pautsch

IPC: H05K007/20

CPC classification number: H05K7/20345 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.

Abstract translation: 一种用于冷却电子部件的系统和方法。 将液体加热到接近其沸点的温度并且对准电子部件，使得一部分加热的液体蒸发，形成混合相流体。 将混合相流体从电子部件中抽出，蒸气冷凝回液体。