公开(公告)号：US20210005793A1

公开(公告)日：2021-01-07

申请号：US17016701

申请日：2020-09-10

Applicant: Cree, Inc.

Inventor： Kyle Damborsky ,  Derek Miller ,  Jack Vu ,  Peter Scott Andrews ,  Jasper Cabalu ,  Colin Blakely ,  Jesse Reiherzer

IPC: H01L33/52 ,  H01L33/26 ,  H01L33/60 ,  H01L33/50

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

公开(公告)号：US10522722B2

公开(公告)日：2019-12-31

申请号：US15957454

申请日：2018-04-19

Applicant: Cree, Inc.

Inventor： Kyle Damborsky ,  Derek Miller ,  Jack Vu ,  Peter Scott Andrews ,  Jasper Cabalu ,  Colin Blakely ,  Jesse Reiherzer

IPC: H01L33/00 ,  H01L33/52 ,  H01L33/26 ,  H01L33/60 ,  H01L33/50

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

公开(公告)号：US11145689B2

公开(公告)日：2021-10-12

申请号：US16203709

申请日：2018-11-29

Applicant: Cree, Inc.

Inventor： Nikolas Hall ,  Derek Miller ,  Anoop Mathew ,  Colin Blakely ,  Luis Breva ,  Jesse Reiherzer ,  David Todd Emerson

IPC: H01L23/544 ,  H01L27/15 ,  H01L33/22 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED chips and related methods are disclosed. LED chips are provided that include an indicia arranged between a primary light-emitting face and a mounting face of the LED chip. The indicia may include at least one of a logo, one or more alphanumeric characters, or a symbol, among others that are configured to convey information. Arrangements of at least one of an n-contact, a p-contact, or a reflector layer of the LED chip may form the indicia. LED chips are also provided where at least a portion of an indicia is arranged on a mounting face of the LED chip. Indicia are provided that may be visible through primary light-emitting faces when LED chips are electrically activated or electrically deactivated. In this regard, the indicia may be embedded within LED chips while still being able to convey information.

公开(公告)号：US10811573B2

公开(公告)日：2020-10-20

申请号：US16686457

申请日：2019-11-18

Applicant: Cree, Inc.

Inventor： Kyle Damborsky ,  Derek Miller ,  Jack Vu ,  Peter Scott Andrews ,  Jasper Cabalu ,  Colin Blakely ,  Jesse Reiherzer

IPC: H01L33/00 ,  H01L33/52 ,  H01L33/26 ,  H01L33/60 ,  H01L33/50

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

公开(公告)号：US20200105984A1

公开(公告)日：2020-04-02

申请号：US16686457

申请日：2019-11-18

Applicant: Cree, Inc.

Inventor： Kyle Damborsky ,  Derek Miller ,  Jack Vu ,  Peter Scott Andrews ,  Jasper Cabalu ,  Colin Blakely ,  Jesse Reiherzer

IPC: H01L33/52 ,  H01L33/26 ,  H01L33/60 ,  H01L33/50

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

公开(公告)号：US20190326485A1

公开(公告)日：2019-10-24

申请号：US15957454

申请日：2018-04-19

Applicant: Cree, Inc.

Inventor： Kyle Damborsky ,  Derek Miller ,  Jack Vu ,  Peter Scott Andrews ,  Jasper Cabalu ,  Colin Blakely ,  Jesse Reiherzer

IPC: H01L33/52 ,  H01L33/50 ,  H01L33/60 ,  H01L33/26

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

公开(公告)号：US20200176507A1

公开(公告)日：2020-06-04

申请号：US16203709

申请日：2018-11-29

Applicant: Cree, Inc.

Inventor： Nikolas Hall ,  Derek Miller ,  Anoop Mathew ,  Colin Blakely ,  Luis Breva ,  Jesse Reiherzer ,  David Todd Emerson

IPC: H01L27/15 ,  H01L23/544 ,  H01L33/22 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED chips and related methods are disclosed. LED chips are provided that include an indicia arranged between a primary light-emitting face and a mounting face of the LED chip. The indicia may include at least one of a logo, one or more alphanumeric characters, or a symbol, among others that are configured to convey information. Arrangements of at least one of an n-contact, a p-contact, or a reflector layer of the LED chip may form the indicia. LED chips are also provided where at least a portion of an indicia is arranged on a mounting face of the LED chip. Indicia are provided that may be visible through primary light-emitting faces when LED chips are electrically activated or electrically deactivated. In this regard, the indicia may be embedded within LED chips while still being able to convey information.