公开(公告)号：US20200317909A1

公开(公告)日：2020-10-08

申请号：US16753434

申请日：2018-10-05

Applicant: Cytec Industries Inc.

Inventor： Ian ASPIN ,  Nicolas DREUILLES ,  Jonathan MEEGAN

IPC: C08L63/00 ,  C08J5/24 ,  B29B11/10 ,  B29B11/16 ,  B29C70/32

Abstract: A curable resin composition contains a curable resin that comprises at least one non-aromatic epoxy compound, at least one non-aromatic oxetane compound, or a mixture thereof, one or more curing agents selected from Lewis acid:Lewis base complexes, and a cure accelerating amount of one or more anhydride compounds. A method accelerating the cure of a curable resin composition, comprising adding a cure accelerating amount of one or more anhydride compounds to a curable resin composition comprising a curable resin that comprises at least one non-aromatic epoxy compound or non-aromatic oxetane compound and a curing agent that comprises one or more Lewis acid-base complexes. The composition and method are useful in making fiber reinforced resin matrix composite articles.