公开(公告)号：US20200055979A1

公开(公告)日：2020-02-20

申请号：US16342448

申请日：2017-10-03

Applicant: DAICEL CORPORATION

Inventor： Hiroto MIYAKE ,  Kiyoharu TSUTSUMI ,  Ryosuke IEKI

IPC: C08G59/24 ,  C08J5/24 ,  C08G59/68 ,  C08G59/42 ,  C08G59/62 ,  C08G59/50 ,  C08K3/36 ,  C08K3/04

Abstract: Provided is a sheet-like prepreg that has both a low coefficient of linear thermal expansion and high flexibility and offers excellent anti-warpage performance and cracking resistance. The sheet-like prepreg according to the present invention includes a curable composition and a sheet-like porous support impregnated with the curable composition. The sheet-like porous support is made from a material having a coefficient of linear thermal expansion of 10 ppm/K or less. The sheet-like prepreg gives a cured product having a glass transition temperature of −60° C. to 100° C. The curable composition includes one or more curable compounds (A) and at least one of a curing agent (B) and a curing catalyst (C). The curable compounds (A) include an epoxide having a weight per epoxy equivalent of 140 to 3000 g/eq in an amount of 50 weight percent or more of the totality of the curable compounds (A).

公开(公告)号：US20160264822A1

公开(公告)日：2016-09-15

申请号：US15028147

申请日：2014-10-06

Applicant: DAICEL CORPORATION

Inventor： Yousuke ITO ,  Hiroki TANAKA ,  Kiyoharu TSUTSUMI

IPC: C09J5/06 ,  C09J125/08 ,  C09J133/06 ,  C09J4/00 ,  C09J125/18

Abstract: Provided are: an adhesive that offers high adhesiveness to bond and secure an adherend even in a high-temperature environment, as long as securing is necessary. The adherend can be removed without failure and without adhesive residue once securing becomes unnecessary; and a method for processing an adherend using the adhesive. The adhesive according to the present invention contains a multivalent vinyl ether compound (A) and at least one of a compound (B) and a compound (C). The compound (B) is represented by Formula (b). The compound (C) includes two or more constitutional units each represented by Formula (c). Formulae (b) and (c) are expressed as follows:

公开(公告)号：US20190329457A1

公开(公告)日：2019-10-31

申请号：US16462080

申请日：2017-11-16

Applicant: DAICEL CORPORATION

Inventor： Hiroto MIYAKE ,  Kiyoharu TSUTSUMI

IPC: B29C33/40 ,  C08F210/02 ,  C08F232/08 ,  C08G77/06 ,  H01L21/027 ,  G03F7/00

Abstract: Provided is a resin composition capable of forming an imprint replica mold that enables easy removal of a residual layer and enables formation of high-accuracy patterns. The resin composition for replica mold formation includes (A) a thermoplastic or thermosetting resin, and (B) a compound. The resin (A) has a transmittance of light of 50% or more at one or more wavelengths from 200 to 450 nm. The compound (B) is capable of absorbing or scattering light at the wavelength(s). The compound (B) is present in a proportion of 0.5 to 50 parts by weight per 100 parts by weight of the resin (A). The resin (A) is preferably selected from olefinic resins and silicone resins.

公开(公告)号：US20160215183A1

公开(公告)日：2016-07-28

申请号：US15025143

申请日：2014-09-25

Applicant: DAICEL CORPORATION

Inventor： Hiroki TANAKA ,  Katsuhiro NAKAGUCHI ,  Kiyoharu TSUTSUMI ,  Yousuke ITO ,  Naoko TSUJI

IPC: C09J163/00 ,  C09J7/02 ,  H01L23/00

CPC classification number: C09J163/00 ,  C08G59/68 ,  C09J7/35 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/293 ,  H01L24/83 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/83855 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50° C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50° C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the cationic-polymerization initiator (B1) and 100 parts by weight of 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate. The anionic-polymerization initiator (B2) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the anionic-polymerization initiator (B2) and 100 parts by weight of bisphenol-A diglycidyl ether.

Abstract translation: 提供了一种用于多层半导体的粘合剂组合物。 粘合剂组合物通过加热施加和干燥时，在低于50℃的温度下具有大致无粘合性的粘合剂层，但是当在较低温度下加热以致对半导体芯片造成损害时，提供粘合性和 此后迅速治愈。 该多层半导体用粘合剂组合物包含聚合性化合物（A），阳离子聚合引发剂（B1）和阴离子聚合引发剂（B2）中的至少一种和溶剂（C）。 可聚合化合物（A）含有80重量％以上的软化点或熔点为50℃以上的环氧化物。 阳离子聚合引发剂（B1）在130℃下得到热固化时间为3.5分钟以上的组合物，其中组合物含有1重量份的阳离子聚合引发剂（B1）和100重量份的 3,4-环氧环己基甲基（3,4-环氧）环己烷羧酸酯。 阴离子聚合引发剂（B2）在130℃下得到热固化时间为3.5分钟以上的组合物，其中组合物含有1重量份的阴离子聚合引发剂（B2）和100重量份的 双酚A二缩水甘油醚。