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公开(公告)号：US20240381595A1
公开(公告)日：2024-11-14
申请号：US18692961
申请日：2022-09-09
Applicant: DANFOSS A/S
Inventor： Myongsok SONG , Tianlei LI , Hunter KRAMER
Abstract: A refrigerant system according to an example of this disclosure includes a main refrigerant loop in communication with a condenser, an evaporator, and a compressor. A heat exchanger is arranged to cool electronic components. The heat exchanger has a cooling line, which is configured to receive refrigerant from the main refrigerant loop and a heat sink in communication with air surrounding the electronic components.
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