公开(公告)号：US20240006113A1

公开(公告)日：2024-01-04

申请号：US18205564

申请日：2023-06-04

Applicant: DARFON ELECTRONICS CORP.

Inventor： Zuei-Chown Jou ,  Chih-Ho Liu ,  Jui-Wen Kuo ,  Chi-Ming Huang ,  Bo-Yu Huang ,  Yao-Tsung Chen

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/10 ,  H01F41/02

CPC classification number: H01F27/2828 ,  H01F27/292 ,  H01F27/327 ,  H01F41/10 ,  H01F41/0246

Abstract: An inductor includes a coil, a conductive lead frame, and a housing. The coil includes a coil body and a lead protruding from the coil body. The lead has a U-bend portion. The lead is electrically fixed onto the conductive lead frame. The housing encapsulates the coil and exposes the conductive lead frame. A method of manufacturing an inductor includes the following steps: providing a coil, providing a conductive lead frame, making a lead of the coil be electrically fixed onto the conductive lead frame, bending the lead to form a U-bend portion and make the main body of the coil close to a portion of the lead that connects with the conductive lead frame, and forming a housing to encapsulate the coil and expose the conductive lead frame.

公开(公告)号：US20230395320A1

公开(公告)日：2023-12-07

申请号：US18203055

申请日：2023-05-29

Applicant: DARFON ELECTRONICS CORP.

Inventor： Chih-Ho Liu ,  Jui-Wen Kuo ,  Chi-Ming Huang ,  Bo-Yu Huang ,  Yao-Tsung Chen

IPC: H01F41/04 ,  H01F27/29 ,  H01F27/06

CPC classification number: H01F41/04 ,  H01F27/29 ,  H01F27/06

Abstract: An integrated-type coupled inductor is applied to a related manufacturing method and includes a lead frame, a first coil, a second coil and a magnetic packing component. The lead frame has a first surface and a second surface opposite to each other and includes four pins. The first coil is disposed on the first surface and coupled to two of the four pins. The second coil is disposed on the second surface and coupled to other pins. The magnetic packing component covers the first coil and the second coil to expose parts of the four pins.