公开(公告)号：US11688547B2

公开(公告)日：2023-06-27

申请号：US17012919

申请日：2020-09-04

Applicant: DARFON ELECTRONICS CORP.

Inventor： Ping-Hung Lin ,  Zuei-Chown Jou ,  Yung-Ping Wu ,  Chi-Ming Huang ,  Yao-Tsung Chen ,  Bo-Yu Huang

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/29 ,  H01F27/255 ,  H01F41/02 ,  H01F41/04 ,  H01F41/12

CPC classification number: H01F27/32 ,  H01F27/255 ,  H01F27/29 ,  H01F41/0246 ,  H01F41/04 ,  H01F41/127

Abstract: An inductor device and a method of fabricating the same. The inductor device according to the invention includes a conductive coil, a pillar and a cladding body. The pillar is molded from a plurality of first composite material powders by a pressing process. Each first composite material powder is composed of a first magnetic material powder coated with a first thermosetting resin. The cladding body is molded from a plurality of second composite powders. Each second composite material powders is composed of a second magnetic material powder coated with a second thermosetting resin. The first weight ratio of the first thermosetting resin to the first composite material powders is less than the second weight ratio of the second thermosetting resin to the second composite material powders. The cladding body and the conductive coil and the pillar cladded by the cladding body are heated to a curing temperature.