公开(公告)号：US3773997A

公开(公告)日：1973-11-20

申请号：US3773997D

申请日：1971-12-13

Applicant: DATANETICS CORP

Inventor： EVANS P ,  MILLER M ,  MULLER M

IPC: H01H13/20 ,  B41J5/12 ,  B41J5/16 ,  H01H13/705 ,  H01H13/50 ,  H01H3/48 ,  H01H13/36

CPC classification number: B41J5/12 ,  B41J5/16 ,  H01H1/2008 ,  H01H13/705 ,  H01H2003/028 ,  H01H2215/028 ,  H01H2215/034 ,  H01H2221/026 ,  H01H2221/044 ,  H01H2227/028 ,  H01H2227/032 ,  H01H2229/018 ,  H01H2229/044 ,  H01H2233/02 ,  H01H2233/058 ,  H01H2233/086 ,  H01H2233/096 ,  H01H2235/018

Abstract: A key assembly for actuating a diaphragm switch, and including a housing, a keystem movably mounted on the housing, and a switch actuator coupled to the keystem through a lost-motion connection arranged so a relatively large stroke of the keystem is required to effect a small actuator motion needed to operate the switch. A coil spring biases the keystem away from the housing to an extended position in which the switch is not actuated, and a second coil spring urges the actuator away from the keystem. The lost-motion connection between the keystem and actuator provides positive retraction of the actuator during the return stroke of the keystem. A leaf spring on the keystem rides a cam surface or ramp on the housing, and the ramp is shaped to modify the effect of the coil springs such that the keystem tends to toggle past the point of switch actuation to prevent switch jitter and to provide a tactile signal that actuation has occurred.

Abstract translation: 用于致动膜片开关并包括壳体的钥匙组件，可移动地安装在壳体上的钥匙系统，以及通过布置成相对较大的钥匙系列行程的迷失运动连接器耦合到钥匙系统的开关致动器，以实现一个 操作开关所需的小执行器运动。 螺旋弹簧将钥匙远离壳体偏置到未启动开关的延伸位置，而第二螺旋弹簧迫使致动器离开钥匙系统。 钥匙系统和执行器之间的失速连接在钥匙系统的返回冲程期间提供致动器的正向收回。 钥匙上的板簧沿着外壳上的凸轮表面或斜面，并且斜面被成形以改变螺旋弹簧的效果，使得钥匙系统倾向于转过开关致动点以防止开关抖动并提供一个 触发信号已经发生。

公开(公告)号：US3712840A

公开(公告)日：1973-01-23

申请号：US3712840D

申请日：1969-09-08

Applicant: DATANETICS CORP

Inventor： MILLER M

IPC: H05K3/28 ,  A41H37/00

CPC classification number: H05K3/281 ,  H05K2201/10598 ,  H05K2203/068 ,  H05K2203/167

Abstract: A package including at least one hole extending through the entire package and hermetically isolated from the package contents, the package being formed by stacking a plurality os subassemblies between two face sheets of impervious material and aligning the contents by at least one vertical pin through which the hole passes. The package is bonded subsequent to stacking and is clamped together during bonding by a pair of pressure plates, the plates being removed upon completion of bonding to allow the final package to be positioned and aligned in an external apparatus.