公开(公告)号：US11506621B2

公开(公告)日：2022-11-22

申请号：US16290171

申请日：2019-03-01

Applicant: DELPHI TECHNOLOGIES IP LIMITED

Inventor： Gregg N. Francisco ,  Kevin M. Gertiser ,  Jack L. Glenn ,  Narendra J. Mane ,  Thomas E. Pritchett ,  Soumyajit Routh ,  Kok Wee Yeo

IPC: G01N25/18 ,  G01N25/00

Abstract: A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.

公开(公告)号：US20200278309A1

公开(公告)日：2020-09-03

申请号：US16290171

申请日：2019-03-01

Applicant: DELPHI TECHNOLOGIES IP LIMITED

Inventor： Gregg N. Francisco ,  Kevin M. Gertiser ,  Jack L. Glenn ,  Narendra J. Mane ,  Thomas E. Pritchett ,  Soumyajit Routh ,  Kok Wee Yeo

IPC: G01N25/18

Abstract: A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.