公开(公告)号：US09781821B2

公开(公告)日：2017-10-03

申请号：US15074558

申请日：2016-03-18

Applicant: DELTA ELECTRONICS, INC.

Inventor： Lee-Lung Chen ,  Ching-Shun Wang ,  Jin-Hong Cai

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/0203 ,  H01L23/38 ,  H01L35/00 ,  H05K1/0206 ,  H05K1/115 ,  H05K1/144 ,  H05K1/145 ,  H05K7/20854 ,  H05K2201/042 ,  H05K2201/10219

Abstract: A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.