公开(公告)号：US20240010806A1

公开(公告)日：2024-01-11

申请号：US18043979

申请日：2021-06-07

Applicant: Denka Company Limited

Inventor： Takeshi SAITO ,  Ryosuke YANAKA

IPC: C08J7/044 ,  B65D1/40 ,  C09D183/04 ,  B65D73/02

CPC classification number: C08J7/044 ,  B65D1/40 ,  C09D183/04 ,  B65D73/02 ,  B65D2501/24

Abstract: A resin sheet for molding includes a base material sheet, and a surface layer provided on at least one surface of the base material sheet and including silicone, wherein the silicone content in the surface layer is 0.3 to 4.0 g/m2, and wherein the base material sheet is formed of a resin composition including 29 to 65 parts by mass of a Styrene-conjugated diene block copolymer (A), 25 to 60 parts by mass of a polystyrene resin (B), and 8 to 20 parts by mass of a high-impact polystyrene resin (C) (provided that a total amount of the component (A), the component (B), and the component (C) is 100 parts by mass). A carrier tape 100 is a molded body 16 of the resin sheet, wherein an accommodation portion 20 capable of accommodating an article is provided.

公开(公告)号：US20230084488A1

公开(公告)日：2023-03-16

申请号：US17793538

申请日：2021-03-08

Applicant: DENKA COMPANY LIMITED

Inventor： Yuko FUKUDA ,  Junpei FUJIWARA ,  Ryosuke YANAKA

IPC: H01L21/683 ,  B32B27/08 ,  B32B27/20

Abstract: A layered sheet 10 includes a substrate layer 1, and surface layers 2 and 3 configured to be layered on at least one surface of the substrate layer 1. The substrate layer 1 contains a first thermoplastic resin and inorganic fillers. The surface layers 2 and 3 contain a second thermoplastic resin and a conductive material. A content of the inorganic fillers in the substrate layer 1 is 0.3 to 28 mass % based on a total amount of the substrate layer.

公开(公告)号：US20240309158A1

公开(公告)日：2024-09-19

申请号：US18271597

申请日：2022-02-01

Applicant: DENKA COMPANY LIMITED

Inventor： Ikuka INODA ,  Ryosuke YANAKA ,  Takeshi SAITO

IPC: C08J5/18

CPC classification number: C08J5/18 ,  C08J2325/14 ,  C08J2409/06

Abstract: A resin sheet for electronic component packaging with transparency, excellent folding endurance, and also excellent low-temperature heat sealing property, and an electronic component packaging container using the resin sheet. A resin sheet for electronic component packaging, the resin sheet composed of a rubber-modified aromatic vinyl-based copolymer resin that includes rubber-type polymers (Y) as dispersed particles in a continuous matrix resin (X), and that satisfies (1) and (2): (1) the continuous matrix resin (X) is a copolymer of 53-63 mass % of one or more aromatic vinyl-based compounds (x1) and 37-47 mass % of one or more (meth)acrylic acid alkyl esters (x2); and (2) the ratio of the rubber-type polymers (Y) to the total mass of the rubber-modified aromatic vinyl-based copolymer resin is 5 mass % or more and less than 10 mass %.

公开(公告)号：US20240059053A1

公开(公告)日：2024-02-22

申请号：US18269817

申请日：2021-12-14

Applicant: DENKA COMPANY LIMITED

Inventor： Takeshi SAITO ,  Ikuka INODA ,  Ryosuke YANAKA

IPC: B32B27/08 ,  B32B27/30

CPC classification number: B32B27/08 ,  B32B27/308 ,  B32B27/302 ,  B32B2553/00 ,  B32B2307/7376 ,  B32B2250/44 ,  B32B2250/42 ,  B32B2250/24

Abstract: An electronic device packaging sheet including a substrate sheet having at least one substrate layer including: a thermoplastic resin (I); and a resin (II) which includes at least one copolymer selected from a (meth)acrylic acid alkyl ester copolymer (A) and a styrene-acrylonitrile copolymer (B) that have a weight-average molecular weight of 700,000-4,300,000. The substrate sheet has at least one substrate layer comprising the thermoplastic resin (I) at 70-99 mass % and the resin (II) at 1-30 mass %.

公开(公告)号：US20230279190A1

公开(公告)日：2023-09-07

申请号：US18005784

申请日：2021-06-07

Applicant: Denka Company Limited

Inventor： Ryosuke YANAKA ,  Takeshi SAITO ,  Kota SAWAGUCHI

IPC: C08J5/18 ,  C08K3/04 ,  C08L9/06 ,  C08L69/00 ,  B65D75/28 ,  B32B27/36 ,  B32B27/30 ,  B32B27/08 ,  B32B27/20 ,  B32B7/02

CPC classification number: C08J5/18 ,  C08K3/04 ,  C08L9/06 ,  C08L69/00 ,  B65D75/28 ,  B32B27/365 ,  B32B27/302 ,  B32B27/08 ,  B32B27/20 ,  B32B7/02 ,  C08J2309/06 ,  C08J2369/00 ,  C08J2409/06 ,  C08J2469/00 ,  C08K2201/005 ,  C08K2201/001 ,  B32B2270/00 ,  B32B2307/558 ,  B32B2264/108 ,  B32B2264/303 ,  B32B2307/546 ,  B32B2439/40 ,  B32B2250/24

Abstract: A resin sheet is for molding, has an impact strength of 1.0 J or greater in a DuPont impact test, and has a value of 80 N/m2 or smaller obtained through integration from an origin point to a strain when fracture has occurred in a stress strain curve obtained in a tensile test. A carrier tape 100 is a molded body 16 of the resin sheet, wherein an accommodation portions 20 capable of accommodating an article is provided.

公开(公告)号：US20240317475A1

公开(公告)日：2024-09-26

申请号：US18269867

申请日：2021-12-14

Applicant: DENKA COMPANY LIMITED

Inventor： Ikuka INODA ,  Takeshi SAITO ,  Ryosuke YANAKA

IPC: B65D65/40 ,  B65D85/68

CPC classification number: B65D65/40 ,  B65D85/68 ,  B65D2585/86

Abstract: An electronic device packaging sheet provided with a substrate sheet in which a substrate layer A and a substrate layer B are alternately laminated, wherein: the thickness of an individual substrate layer A is 10-60 μm; the thickness of an individual substrate layer B is 1-50 μm; the average value of the thickness of an individual substrate layer A is greater than the average value of the thickness of an individual substrate layer B; and the substrate layer A and the substrate layer B include a different thermoplastic resin as a main component.

公开(公告)号：US20220194067A1

公开(公告)日：2022-06-23

申请号：US17604341

申请日：2020-04-16

Applicant: DENKA COMPANY LIMITED

Inventor： Ryosuke YANAKA ,  Junpei FUJIWARA

IPC: B32B27/30

Abstract: A layered sheet has a substrate layer and surface layers provided on both surfaces of the substrate layer, wherein the surface layers contain 50 to 90 mass % of component (A) defined below and 10 to 50 mass % of component (B) defined below relative to the overall mass of the surface layer; the substrate layer is composed of a vinyl aromatic hydrocarbon resin composition containing monomer units derived from conjugated dienes; and a percentage of the monomer units derived from the conjugated dienes in the substrate layer is 6 to 14 mass % relative to all monomer units in the vinyl aromatic hydrocarbon-based resin composition. Component (A) is a rubber-modified (meth)acrylic acid ester-vinyl aromatic hydrocarbon copolymer in which the percentage of a conjugated diene rubber component is 5 to 25 mass %. Component (B) is a polymeric antistatic agent.

公开(公告)号：US20210162721A1

公开(公告)日：2021-06-03

申请号：US16954340

申请日：2019-01-23

Applicant: DENKA COMPANY LIMITED

Inventor： Ryosuke YANAKA ,  Yusuke MASUDA

IPC: B32B25/04 ,  C08F220/14 ,  C08F212/08 ,  C08F236/06 ,  B32B25/16 ,  B65D65/40

Abstract: A laminated sheet with a cover material, an adhesive cover tape, and an electronic component packaging container molded. A laminated sheet having a surface layer on both sides of a substrate layer, and the substrate layer includes 30 to 70 mass % of a component mentioned below, 70 to 30 mass % of a component mentioned below, and 0 to 30 mass % of a recycled material of the laminated sheet to the total mass of the substrate layer. The component is a rubber modified (meth)acrylic acid ester-vinyl aromatic hydrocarbon copolymer having a conjugated diene rubber component content of 5 to 15 mass %. The component is a vinyl aromatic hydrocarbon-conjugated diene block copolymer containing 15 to 30 mass % of monomeric units derived from conjugated dienes. The component is at least one polymer selected from the group consisting of a vinyl aromatic hydrocarbon polymer and a rubber modified vinyl aromatic hydrocarbon polymer.