公开(公告)号：US20240417544A1

公开(公告)日：2024-12-19

申请号：US18701748

申请日：2022-10-07

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA ,  Tsuyoshi KANEKO ,  Takako EBISUZAKI

IPC: C08K9/06 ,  C09C1/30

Abstract: Provided are spherical silica particles that can achieve a lower dielectric dissipation factor when used to fill a resin, and a resin composition using the same. The spherical silica particles (X) are those in which the number of water molecules desorbed from the spherical silica particles (X) when the spherical silica particles (X) are heated from 50° C. to 1000° C. at a rate of temperature increase of 25° C./min. is 0.001-0.010 mmoL/g and in which the specific surface area is 0.1-2.0 m2/g. The resin composition contains the silica particles (X) and at least one resin selected from a thermoplastic resin and a thermosetting resin.