公开(公告)号：US12154818B2

公开(公告)日：2024-11-26

申请号：US17793538

申请日：2021-03-08

Applicant: DENKA COMPANY LIMITED

Inventor： Yuko Fukuda ,  Junpei Fujiwara ,  Ryosuke Yanaka

IPC: B32B27/20 ,  B32B27/08 ,  H01L21/683

Abstract: A layered sheet 10 includes a substrate layer 1, and surface layers 2 and 3 configured to be layered on at least one surface of the substrate layer 1. The substrate layer 1 contains a first thermoplastic resin and inorganic fillers. The surface layers 2 and 3 contain a second thermoplastic resin and a conductive material. A content of the inorganic fillers in the substrate layer 1 is 0.3 to 28 mass % based on a total amount of the substrate layer.

公开(公告)号：US12119255B2

公开(公告)日：2024-10-15

申请号：US17793538

申请日：2021-03-08

Applicant: DENKA COMPANY LIMITED

Inventor： Yuko Fukuda ,  Junpei Fujiwara ,  Ryosuke Yanaka

IPC: B32B27/20 ,  B32B27/08 ,  H01L21/683

CPC classification number: H01L21/6836 ,  B32B27/08 ,  B32B27/20 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2260/046 ,  B32B2264/108 ,  B32B2305/30 ,  B32B2313/04 ,  B32B2398/20 ,  B32B2439/02

Abstract: A layered sheet 10 includes a substrate layer 1, and surface layers 2 and 3 configured to be layered on at least one surface of the substrate layer 1. The substrate layer 1 contains a first thermoplastic resin and inorganic fillers. The surface layers 2 and 3 contain a second thermoplastic resin and a conductive material. A content of the inorganic fillers in the substrate layer 1 is 0.3 to 28 mass % based on a total amount of the substrate layer.