Patent search ap:("DENSO CORPORATION") AND inv:"Gentarou MASUDA" Page 1

1.

发明申请
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE 有权

公开(公告)号：US20220115283A1

公开(公告)日：2022-04-14

申请号：US17559608

申请日：2021-12-22

Applicant: DENSO CORPORATION

Inventor： Akihiro YAMAGUCHI , Norihisa IMAIZUMI , Ryuma KAMIKOMAKI , Kouji KONDOH , Hirotaka MIYANO , Tomohiro YOKOCHI , Gentarou MASUDA

IPC: H01L23/29 , H01L21/56

Abstract: A semiconductor package includes a semiconductor chip, a heat radiating member on which the semiconductor chip is mounted, and a sealing member sealing the semiconductor chip. The sealing member is made of a liquid crystal polymer.

Patent Agency Ranking