公开(公告)号：US20230284373A1

公开(公告)日：2023-09-07

申请号：US18167491

申请日：2023-02-10

Applicant: DENSO CORPORATION

Inventor： ERIKO YAZU ,  RYOSUKE OMURA ,  KAZUKI TAKAHASHI ,  KENICHI TAKESHIMA ,  YUICHIRO SASAKI

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/023 ,  H05K1/181

Abstract: In a circuit board, a printed board includes an insulating base and a plurality of conductors disposed in layers in the insulating base. The conductors include a signal line electrically connected to an electronic component; and a potential fixed layer fixed to a predetermined potential and arranged to face the signal line across the insulating base in a thickness direction of the printed board. The potential fixed layer has a facing surface facing the signal line, and is provided with a high magnetic film having a magnetic permeability higher than that of the at least one potential fixed layer on the facing surface. The high magnetic film is disposed to overlap the signal line in the thickness direction. The signal line includes a facing line that faces the high magnetic film across the insulating base in the thickness direction.