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公开(公告)号：US11538733B2
公开(公告)日：2022-12-27
申请号：US16919330
申请日：2020-07-02
Applicant: DENSO CORPORATION
Inventor： Toshihiro Miyake
IPC: H01L23/373 , C22C9/00 , C22C5/02 , C22C21/00 , H01L23/00 , H01L23/495
Abstract: An electronic device includes a metal member and a connected member. A metal connecting layer is provided between a lower-side surface of the metal member and an upper-side surface of the connected member, to connect the metal member and the connected member to each other. The metal connecting layer includes at least one of metal films, each of which is made of gold or gold alloy. A thickness of the metal connecting layer in an opposing area between the metal member and the connected member is smaller than a flatness of each of the lower-side surface and the upper-side surface. A rust-preventing film is formed on a side wall of the metal member in such a way that the rust-preventing film extends from an outer periphery of the metal connecting layer to a position away from the outer periphery by a predetermined distance.
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公开(公告)号：US09743531B2
公开(公告)日：2017-08-22
申请号：US15163897
申请日：2016-05-25
Applicant: DENSO CORPORATION
Inventor： Toshihiro Miyake
CPC classification number: H05K3/325 , H01R12/585 , H01R13/03 , H05K1/115 , H05K3/308 , H05K2201/10295 , H05K2203/1157 , H05K2203/1189
Abstract: An electronic apparatus includes a connection target member that has a first connection portion including copper or copper alloy, a connection terminal that has a second connection portion including copper or copper alloy, the second connection portion mechanically connecting with the first connection portion by spring reaction force of the connection terminal, and a joint portion that is provided with a contact point between the first connection portion and the second connection portion. At least one of the first connection portion and the second connection portion includes an oxide film at a periphery of the joint portion on a surface thereof, the oxide film including copper oxide. The joint portion directly joints copper included in the first connection portion and copper included in the second connection portion metallurgically.
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公开(公告)号：US11849566B2
公开(公告)日：2023-12-19
申请号：US17509242
申请日：2021-10-25
Applicant: DENSO CORPORATION
Inventor： Toshihiro Miyake , Tadatomo Suga , Eiji Higurashi
IPC: H05K7/20 , H05K1/02 , H05K3/00 , H01L23/373
CPC classification number: H05K7/20472 , H01L23/3735 , H05K1/0204 , H05K3/0061
Abstract: A joint structure includes a first member, a second member and a metal joint layer. The first member has including a first surface and is made of material having one of copper, copper alloy, aluminum, or aluminum alloy. The second member includes a second surface that faces the first surface of the first material. The metal joint layer includes a gold joint layer made of material having gold or gold alloy and is disposed between the first surface of the first material and the second surface of the second material. A thickness of the metal joint layer is smaller than flatness of the first surface of the first material and flatness of the second surface of the second material. Fluorine is dispersed inside at least the gold joint layer included in the metal joint layer.
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公开(公告)号：US09970121B2
公开(公告)日：2018-05-15
申请号：US14982048
申请日：2015-12-29
Applicant: DENSO CORPORATION
Inventor： Kenji Ochi , Toshihiro Miyake , Yasuo Ishihara
IPC: C25D9/02 , C25D3/12 , C25D3/22 , C25D3/38 , C25D3/56 , C25D5/00 , C25D7/00 , C25D15/00 , H01R13/03
CPC classification number: C25D9/02 , C25D3/12 , C25D3/22 , C25D3/38 , C25D3/56 , C25D5/00 , C25D7/00 , C25D15/00 , H01R13/03
Abstract: A composite material includes a metal material having conductivity and an oxidation inhibitor mixed with the metal material. The oxidation inhibitor forms a complex with the metal material to exert a resistance to oxidation of the metal material. For example, the composite material is formed on a surface of a base material as a plating material. As another example, the composite material is plated on a surface of an electrode.
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5.发明授权Press-fit pin, connection structure including the press-fit pin, and electronic device including the press-fit pin 有权压配合销，包括压配合销的连接结构和包括压配销的电子装置公开(公告)号：US09093780B2
公开(公告)日：2015-07-28
申请号：US14036906
申请日：2013-09-25
Applicant: DENSO CORPORATION
Inventor： Toshihiro Miyake
CPC classification number: H01R12/585 , H01R13/03
Abstract: A tip end and a base end therebetween define an opening located between a first conductive portion and a second conductive portion. The opening includes a pair of first linear portions, a pair of second linear portions, and a pair of third linear portions, which are located between the first conductive portion and the second conductive portion. The pair of first linear portions is in straight liner shapes and distant from both the tip end and the base end. The second linear portions are in straight liner shapes and located on the side of the tip end to have therebetween a distance decreasing toward the tip end. The third linear portions are in straight liner shapes and located on the side of the base end to have therebetween a distance decreasing toward the base end.
Abstract translation: 顶端和底端之间限定了位于第一导电部分和第二导电部分之间的开口。 开口包括位于第一导电部分和第二导电部分之间的一对第一直线部分，一对第二直线部分和一对第三直线部分。 一对第一直线部分是直的衬垫形状并且远离顶端和底端。 第二直线部分是直的衬垫形状，并且位于尖端的一侧，以使它们之间朝向尖端减小距离。 第三线性部分是直的衬垫形状并且位于基端侧，以使它们之间朝向基端减小距离。
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Patent Agency Ranking
公开(公告)号：US09698506B2
公开(公告)日：2017-07-04
申请号：US14926134
申请日：2015-10-29
Applicant: DENSO CORPORATION
Inventor： Toshihiro Miyake
CPC classification number: H01R12/7076 , H01R12/58
Abstract: An electric connection structure electrically connecting an electric device and a circuit board includes a connection terminal including a press-welded terminal portion welded to a device terminal of the electric device by pressing, and a press-fit terminal portion fitted in a through-hole of the circuit board by pressing. A direction of the pressing of the press-welded terminal portion against the device terminal is the same as a direction of the pressing of the press-fit terminal portion into the through-hole.
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7.发明申请公开(公告)号：US20130081855A1
公开(公告)日：2013-04-04
申请号：US13630056
申请日：2012-09-28
Applicant: Denso Corporation
Inventor： Toshihiro Miyake
CPC classification number: H01B1/026 , C25D3/32 , C25D3/38 , C25D3/58 , C25D3/60 , C25D15/00 , H01B1/02 , H01R13/03
Abstract: A composite material includes a metal matrix of a metal and a reducing agent. The reducing agent is dispersed in the metal matrix and is capable of reducing an oxide of the metal at room temperature. Even when the oxide of the metal is generated on a surface of the composite material, the reducing agent reduces the oxide of the metal to the metal
Abstract translation: 复合材料包括金属和还原剂的金属基质。 还原剂分散在金属基质中，能够在室温下还原金属的氧化物。 即使当在复合材料的表面上产生金属的氧化物时，还原剂还原金属对金属的氧化物
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公开(公告)号：US12041753B2
公开(公告)日：2024-07-16
申请号：US17542589
申请日：2021-12-06
Applicant: DENSO CORPORATION
Inventor： Toshihiro Miyake
CPC classification number: H05K7/2039 , H01L23/36
Abstract: An electronic device includes a heat generator including at least an electronic component generating heat, a case dissipating heat from the heat generator, a heat conductive member conducting heat of the heat generator to a heat dissipation member, and a metal bonding layer interposing between the heat generator and the heat conductive member and including at least a first bonding layer using gold or gold alloy as a constituting material. Thickness of the metal bonding layer is smaller than flatness of a bonding region which is bonded to a metal bonding layer on a facing surface of the heat generator and a facing surface of the heat conductive member. The heat conductive member has flexibility, is joined to the heat generator via the metal bonding layer, and is in contact with the case.
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9.发明授权Composite material, electric contact electrode, electric contact film, conductive filler, electric contact structure using composite material, and manufacturing method of composite material 有权复合材料，电接触电极，电接触膜，导电填料，使用复合材料的电接触结构，以及复合材料的制造方法公开(公告)号：US09305676B2
公开(公告)日：2016-04-05
申请号：US13630056
申请日：2012-09-28
Applicant: DENSO CORPORATION
Inventor： Toshihiro Miyake
CPC classification number: H01B1/026 , C25D3/32 , C25D3/38 , C25D3/58 , C25D3/60 , C25D15/00 , H01B1/02 , H01R13/03
Abstract: A composite material includes a metal matrix of a metal and a reducing agent. The reducing agent is dispersed in the metal matrix and is capable of reducing an oxide of the metal at room temperature. Even when the oxide of the metal is generated on a surface of the composite material, the reducing agent reduces the oxide of the metal to the metal
Abstract translation: 复合材料包括金属和还原剂的金属基质。 还原剂分散在金属基质中，能够在室温下还原金属的氧化物。 即使当在复合材料的表面上产生金属的氧化物时，还原剂还原金属对金属的氧化物
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10.发明申请PRESS-FIT PIN, CONNECTION STRUCTURE INCLUDING THE PRESS-FIT PIN, AND ELECTRONIC DEVICE INCLUDING THE PRESS-FIT PIN 有权新闻专用PIN，连接结构，包括印刷电话PIN，以及包括印刷电话PIN的电子设备公开(公告)号：US20140213080A1
公开(公告)日：2014-07-31
申请号：US14036906
申请日：2013-09-25
Applicant: DENSO CORPORATION
Inventor： Toshihiro Miyake
IPC: H01R13/58
CPC classification number: H01R12/585 , H01R13/03
Abstract: A tip end and a base end therebetween define an opening located between a first conductive portion and a second conductive portion. The opening includes a pair of first linear portions, a pair of second linear portions, and a pair of third linear portions, which are located between the first conductive portion and the second conductive portion. The pair of first linear portions is in straight liner shapes and distant from both the tip end and the base end. The second linear portions are in straight liner shapes and located on the side of the tip end to have therebetween a distance decreasing toward the tip end. The third linear portions are in straight liner shapes and located on the side of the base end to have therebetween a distance decreasing toward the base end.
Abstract translation: 顶端和底端之间限定了位于第一导电部分和第二导电部分之间的开口。 开口包括位于第一导电部分和第二导电部分之间的一对第一直线部分，一对第二直线部分和一对第三直线部分。 一对第一直线部分是直的衬垫形状并且远离顶端和底端。 第二直线部分是直的衬垫形状，并且位于尖端的一侧，以使它们之间朝向尖端减小距离。 第三线性部分是直的衬垫形状并且位于基端侧，以使它们之间朝向基端减小距离。
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