公开(公告)号：US20200281069A1

公开(公告)日：2020-09-03

申请号：US16794605

申请日：2020-02-19

Applicant: DENSO TEN Limited

Inventor： Nobuhisa KATADA ,  Kotaro HOSOGI ,  Yasuyuki WATANABE ,  Toshiyuki TANAKA

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

Abstract: A printed wiring board according to an embodiment includes a wiring board body, a first connection part and a second connection part. In the first connection part, a heat-receiving front surface is a first land formed on a front surface of the wiring board body. A heat-receiving back surface is formed on a back surface of the wiring board body. A main-heat conducting part is a through-hole that inter-connects the heat-receiving front surface and the heat-receiving back surface. In the second connection part, a second land is formed on the front surface of the wiring board body. The second land is not connected to any conductor pattern formed on the back surface of the wiring board body.

公开(公告)号：US20220323989A1

公开(公告)日：2022-10-13

申请号：US17435374

申请日：2020-09-08

Applicant: DENSO TEN Limited

Inventor： Hisaki HAYASHI ,  Yasuyuki WATANABE ,  Katsuhiro YOSHIMURA ,  Yoshiyuki ANDOH ,  Yasuo NISHIOKA ,  Shigeki FUKAYA

IPC: B05C21/00 ,  B05C11/10 ,  B05D1/26

Abstract: An application device according to an embodiment includes a liquid nozzle part, an air nozzle part, and an ejection controlling unit. The liquid nozzle part ejects liquid to be applied to an electronic component mounted on a substrate. The air nozzle part ejects air toward the substrate. The air nozzle is concentrically arranged with respect to the liquid nozzle part. The ejection controlling unit ejects the air from the air nozzle part at a timing in synchronization with an ejection timing of the liquid to be applied by the liquid nozzle part.