公开(公告)号：US20190067234A1

公开(公告)日：2019-02-28

申请号：US16176923

申请日：2018-10-31

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi SARUYAMA ,  Yasushi AKUTSU

IPC: H01L23/00 ,  H01R4/04 ,  H05K3/32

Abstract: An anisotropic conductive film 1A includes a conductive particle array layer 4 in which a plurality of conductive particles 2 are arrayed in a prescribed manner and held in an insulating resin layer 3. The anisotropic conductive film 1A has a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer 3 holding the array of the conductive particles 2 is asymmetric with respect to the conductive particle 2. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film 1A, short circuits and conductive failure can be reduced.

公开(公告)号：US20160381801A1

公开(公告)日：2016-12-29

申请号：US15112872

申请日：2015-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi SARUYAMA ,  Yasushi AKUTSU

IPC: H05K1/18 ,  H05K3/32 ,  C09J5/00 ,  C09J201/00 ,  C09J9/02 ,  C09J11/04

CPC classification number: H05K1/181 ,  C09J5/00 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  C09J2203/326 ,  H01L2224/81203 ,  H01L2224/83101 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0203

Abstract: Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body has an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent; the anisotropic conductive adhesive agent contains a binder resin layer in which conductive particles are regularly arranged; an inter-particle distance among the conductive particles in a space between connection electrodes formed on the electronic component being greater than the inter-particle distance among the conductive particles trapped between the connection electrodes and substrate electrodes formed on the circuit substrate.

Abstract translation: 确保电子部件与电路基板的布线中的间距减小的电路基板与电子部件的电极之间的导通，并防止电子部件的电极端子之间的短路。 连接体具有通过各向异性导电粘合剂连接到电路基板的电子部件; 各向异性导电粘合剂含有导电性粒子规则排列的粘合剂树脂层; 形成在电子部件上的连接电极之间的空间中的导电粒子之间的粒子间距离大于截留在形成于电路基板上的连接电极和基板电极之间的导电粒子之间的粒子间距离。

公开(公告)号：US20160155717A1

公开(公告)日：2016-06-02

申请号：US14904519

申请日：2014-07-29

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi SARUYAMA ,  Yasushi AKUTSU

IPC: H01L23/00

CPC classification number: H01L24/29 ,  H01L24/27 ,  H01L2224/27005 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/29018 ,  H01L2224/29076 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01R4/04 ,  H05K3/323 ,  H01L2924/00014

Abstract: An anisotropic conductive film includes a conductive particle array layer in which a plurality of conductive particles are arrayed in a prescribed manner and held in an insulating resin layer. The anisotropic conductive film has a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer holding the array of the conductive particles is asymmetric with respect to the conductive particle. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film, short circuits and conductive failure can be reduced.

Abstract translation: 各向异性导电膜包括其中多个导电颗粒以规定的方式排列并保持在绝缘树脂层中的导电粒子阵列层。 各向异性导电膜具有这样的方向，其中保持导电颗粒阵列的绝缘树脂层的单个导电颗粒周围的厚度分布相对于导电颗粒是不对称的。 厚度分布不对称的方向在多个导电颗粒中沿同一方向排列。 当使用这种各向异性导电膜安装电子部件时，可以减少短路和导电故障。

公开(公告)号：US20170236795A1

公开(公告)日：2017-08-17

申请号：US15584609

申请日：2017-05-02

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi SARUYAMA ,  Yasushi AKUTSU

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/14131 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81395 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83499 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2924/381 ,  H01L2924/00 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/066 ,  H01L2924/069 ,  H01L2924/0635 ,  H01L2924/01006

Abstract: Even in case of conductive particles being clamped between stepped sections of substrate electrodes and electrode terminals, conductive particles sandwiched between each main surface of the substrate electrodes and electrode terminals are sufficiently compressed, ensuring electrical conduction. An electronic component is connected to a circuit substrate via an anisotropic conductive adhesive agent, on respective edge-side areas of substrate electrodes of the circuit substrate and electrode terminals of the electronic component, stepped sections are formed and abutted, conductive particles are sandwiched between each main surface and stepped sections of the substrate electrodes and electrode terminals; the conductive particles and stepped sections satisfy formula, a+b+c≦0.8 D (1), wherein a is height of the stepped section of the electrode terminals, b is height of the stepped section of the substrate electrodes, c is gap distance between each stepped sections and D is diameter of conductive particles.

公开(公告)号：US20160351531A1

公开(公告)日：2016-12-01

申请号：US15114453

申请日：2015-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi SARUYAMA ,  Yasushi AKUTSU

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/14131 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81395 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83499 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2924/381 ,  H01L2924/00 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/066 ,  H01L2924/069 ,  H01L2924/0635 ,  H01L2924/01006

Abstract: Even in case of conductive particles being clamped between stepped sections of substrate electrodes and electrode terminals, conductive particles sandwiched between each main surface of the substrate electrodes and electrode terminals are sufficiently compressed, ensuring electrical conduction. An electronic component is connected to a circuit substrate via an anisotropic conductive adhesive agent, on respective edge-side areas of substrate electrodes of the circuit substrate and electrode terminals of the electronic component, stepped sections are formed and abutted, conductive particles are sandwiched between each main surface and stepped sections of the substrate electrodes and electrode terminals; the conductive particles and stepped sections satisfy formula, a+b+c≦0.8 D (1), wherein a is height of the stepped section of the electrode terminals, b is height of the stepped section of the substrate electrodes, c is gap distance between each stepped sections and D is diameter of conductive particles.

Abstract translation: 即使在基板电极和电极端子的台阶部之间夹着导电粒子的情况下，夹在基板电极的每个主表面和电极端子之间的导电颗粒被充分地压缩，从而确保导电。 电子部件通过各向异性导电粘合剂在电路基板的基板电极的各个边缘侧区域和电子部件的电极端子上连接到电路基板，台阶部形成并抵接，导电粒子夹在每个 基板电极和电极端子的主表面和阶梯部分; 导电粒子和阶梯部分满足公式a + b +c≤0.8D（1）其中a是电极端子的阶梯部分的高度，b是基板电极的阶梯部分的高度，c是间隙距离 在每个阶梯部分之间，D是导电颗粒的直径。

公开(公告)号：US20210280548A1

公开(公告)日：2021-09-09

申请号：US17328336

申请日：2021-05-24

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi SARUYAMA ,  Yasushi AKUTSU

IPC: H01L23/00 ,  H01R4/04 ,  H05K3/32 ,  B32B3/06 ,  B32B3/30 ,  B32B5/14 ,  B32B3/26

Abstract: An anisotropic conductive film includes a conductive particle array layer in which a plurality of conductive particles are arrayed in a prescribed manner and held in an insulating resin layer. The anisotropic conductive film has a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer holding the array of the conductive particles is asymmetric with respect to the conductive particle. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film, short circuits and conductive failure can be reduced.

公开(公告)号：US20190096844A1

公开(公告)日：2019-03-28

申请号：US16206628

申请日：2018-11-30

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi SARUYAMA ,  Yasushi AKUTSU

IPC: H01L23/00 ,  H01R4/04 ,  H05K3/32

Abstract: An anisotropic conductive film 1A includes a conductive particle array layer 4 in which a plurality of conductive particles 2 are arrayed in a prescribed manner and held in an insulating resin layer The anisotropic conductive film 1A has a direction in which a thick distribution, around the individual conductive particle, of the insulating resin layer 3 holding the array of the conductive particles 2 is asymmetric with respect to the conductive particle 2. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film 1A, short circuits and conductive failure can be reduced.