公开(公告)号：US20210053836A1

公开(公告)日：2021-02-25

申请号：US17042899

申请日：2019-04-02

Applicant: DIC Corporation

Inventor： Shingo TAKADA ,  Kazuo ITOYA ,  Jian-Jun YUAN ,  Takayuki KANEMATSU ,  Masamichi HAYASHI ,  Fumihiko MAEKAWA ,  Yoshiyuki SANO

IPC: C01F7/02 ,  C01B33/26

Abstract: The present invention provides alumina particles having a fixed card-house structure formed of three or more flat plate-like alumina particles and having an average particle diameter of 3 to 1000 μm. Also, there is provided alumina particles having an average particle diameter of 3 to 1000 μm and having a fixed card-house structure in which the three or more flat plate-like alumina are aggregated to be crossed each other at two or more plurality of positions, and the plane directions of the flat plates crossed each other are in a state of disordered arrangement.

公开(公告)号：US20160264832A1

公开(公告)日：2016-09-15

申请号：US15030674

申请日：2014-10-07

Applicant: DIC CORPORATION

Inventor： Jian-Jun YUAN ,  Hiroshi KINOSHITA

IPC: C09K5/14 ,  C08K3/22

CPC classification number: C09K5/14 ,  C01F7/021 ,  C01F7/441 ,  C01P2002/54 ,  C01P2004/32 ,  C01P2004/41 ,  C01P2004/61 ,  C01P2006/12 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/005 ,  C08L101/00 ,  C09C1/407 ,  C08L63/00 ,  C08L81/02

Abstract: The present invention provides a resin composition including aluminum oxide (A) containing molybdenum having a size on the order of μm or less and a resin (B); and a resin molded body formed by molding the resin composition. Also, the present invention provides a heat-dissipating material containing the resin composition; and a heat-dissipating member containing the resin molded body. The heat-dissipating member of the present invention can be used for electronic parts such as electronic devices, electric devices, OA devices or for LED illumination.

Abstract translation: 本发明提供一种包含氧化铝（A）的树脂组合物，其含有尺寸为μm以下的钼和树脂（B）; 以及通过模制树脂组合物而形成的树脂成型体。 另外，本发明提供含有该树脂组合物的散热材料; 以及包含树脂成型体的散热构件。 本发明的散热构件可用于电子设备，电子设备，OA设备或LED照明等电子部件。

公开(公告)号：US20210291272A1

公开(公告)日：2021-09-23

申请号：US17259932

申请日：2018-07-26

Applicant: DIC Corporation

Inventor： Shingo TAKADA ,  Kazuo ITOYA ,  Jian-Jun YUAN ,  Takayuki KANEMATSU ,  Masamichi HAYASHI ,  Fumihiko MAEKAWA ,  Yoshiyuki SANO

IPC: B22F9/30 ,  B22F1/00

Abstract: Flaky alumina particles including mullite in a surface layer of the flaky alumina particles. A method for producing flaky alumina particles including forming a mixture by mixing together an aluminum compound that contains elemental aluminum, a molybdenum compound that contains elemental molybdenum, and silicon or a silicon compound that contains elemental silicon, the aluminum compound being in an amount greater than or equal to 50 mass %, calculated as Al2O3, the molybdenum compound being in an amount less than or equal to 40 mass %, calculated as MoO3, the silicon or the silicon compound being in an amount of 0.5 mass % or greater and less than 10 mass %, calculated as SiO2, relative to a total mass of the flaky alumina particles taken as 100 mass %; and firing the mixture.