公开(公告)号：US11407708B2

公开(公告)日：2022-08-09

申请号：US16623444

申请日：2018-04-24

Applicant: DIC Corporation

Inventor： Yutaka Satou ,  Kazuhisa Yamoto

IPC: C07C69/76 ,  C08G59/42 ,  H01L23/29 ,  H05K1/03

Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided are an active ester compound represented by chemical formula (1): (where in chemical formula (1), Ar1 is a substituted or unsubstituted first aromatic ring group, and each Ar2 is independently a substituted or unsubstituted second aromatic ring group, in which at least one of Ar1 and Ar2 has an unsaturated bond-containing substituent, and n is an integer of 2 or 3), a curable composition containing the active ester compound, and a cured product thereof.

公开(公告)号：US20170320994A1

公开(公告)日：2017-11-09

申请号：US15512637

申请日：2015-09-24

Applicant: DIC CORPORATION

Inventor： Kazuo Arita ,  Tatsuya Okamoto ,  Kazuhisa Yamoto ,  Yutaka Sato

IPC: C08G14/10 ,  C09K5/14 ,  C09K21/14 ,  H01L23/29 ,  C08L63/04 ,  H05K1/03 ,  C08J5/24 ,  C08L61/28 ,  H05K3/18 ,  H05K3/00 ,  H05K3/42

CPC classification number: C08G14/10 ,  C08G59/62 ,  C08G59/64 ,  C08J5/24 ,  C08J2361/28 ,  C08J2363/04 ,  C08J2461/28 ,  C08J2461/34 ,  C08J2463/04 ,  C08L61/28 ,  C08L61/34 ,  C08L63/04 ,  C08L2201/02 ,  C08L2201/08 ,  C09K5/14 ,  C09K21/14 ,  H01L23/14 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0326 ,  H05K1/0346 ,  H05K3/005 ,  H05K3/18 ,  H05K3/42 ,  H01L2924/00 ,  C08L63/00

Abstract: A triazine ring-containing phenol resin obtained by reacting melamine, para-alkylphenol, and formalin is used to provide an epoxy resin composition capable of providing a cured product with excellent flame retardancy, excellent dielectric characteristics such as a low dielectric tangent and a low dielectric constant, and excellent thermal conductivity, a cured product thereof, and a prepreg, a circuit board, a build-up film, a build-up board, a semiconductor sealing material, a semiconductor device, a fiber reinforced composite material, and a formed article using the epoxy resin composition.

公开(公告)号：US20200207700A1

公开(公告)日：2020-07-02

申请号：US16623444

申请日：2018-04-24

Applicant: DIC Corporation

Inventor： Yutaka Satou ,  Kazuhisa Yamoto

IPC: C07C69/76 ,  C08G59/42 ,  H01L23/29 ,  H05K1/03

Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided are an active ester compound represented by chemical formula (1): (where in chemical formula (1), Ar1 is a substituted or unsubstituted first aromatic ring group, and each Ar2 is independently a substituted or unsubstituted second aromatic ring group, in which at least one of Ar1 and Ar2 has an unsaturated bond-containing substituent, and n is an integer of 2 or 3), a curable composition containing the active ester compound, and a cured product thereof.

公开(公告)号：US20210009804A1

公开(公告)日：2021-01-14

申请号：US17041674

申请日：2019-03-14

Applicant: DIC Corporation

Inventor： Yutaka Satou ,  Kazuhisa Yamoto ,  Koji Hayashi

IPC: C08L67/02 ,  C08G63/547 ,  H05K1/03 ,  H01L23/29

Abstract: A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.

公开(公告)号：US10800914B2

公开(公告)日：2020-10-13

申请号：US16313293

申请日：2017-06-22

Applicant: DIC Corporation

Inventor： Yutaka Satou ,  Akito Kawasaki ,  Tatsuya Okamoto ,  Kazuhisa Yamoto

IPC: C08L67/02 ,  H01L23/31 ,  H01L23/29 ,  C08G59/02 ,  H05K1/03 ,  C08L61/06 ,  H01B3/42 ,  C08L63/00

Abstract: Provided are an active ester composition capable of exhibiting high curability and forming a cured product with various excellent properties such as low dielectric properties, a cured product thereof, and a semiconductor encapsulating material and a printed wiring board which are obtained using the active ester composition. The active ester composition includes, as essential components, an active ester compound (A) and a phenolic hydroxyl group-containing compound (B), in which the active ester compound (A) is an esterification product of a compound having one phenolic hydroxyl group in the molecular structure (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2). Also provided are a cured product thereof, and a semiconductor encapsulating material and a printed wiring board which are obtained using the active ester composition.

公开(公告)号：US20200087444A1

公开(公告)日：2020-03-19

申请号：US16495482

申请日：2018-03-13

Applicant: DIC Corporation

Inventor： Kazuhisa Yamoto ,  Gensuke Akimoto ,  Nobuya Nakamura

IPC: C08G59/24 ,  C08L63/04 ,  C08G59/50 ,  C08G59/62 ,  C08G59/40 ,  C08G59/42

Abstract: It is an issue to provide an epoxy resin that has excellent fluidity and curability, that provides a cured product with favorable moisture resistance and mechanical strength, and that is suitable for use in a semiconductor sealing material, a circuit board, and the like, to provide a method for producing the epoxy resin, and to provide an epoxy resin composition containing the epoxy resin and a cured product of the epoxy resin composition. Specifically, an epoxy resin that is epoxy resin (A) primarily containing epoxidized dihydroxybenzene in which an alkyl group having a carbon number of 1 to 8 may be included as a substituent on an aromatic ring, wherein the area ratio of the maximum peak in GPC measurement is 90% or more, a method for producing the epoxy resin, an epoxy resin composition containing the epoxy resin, and a cured product of the epoxy resin composition are provided.

公开(公告)号：US11901249B2

公开(公告)日：2024-02-13

申请号：US17041674

申请日：2019-03-14

Applicant: DIC Corporation

Inventor： Yutaka Satou ,  Kazuhisa Yamoto ,  Koji Hayashi

IPC: C08G63/547 ,  H01L23/29 ,  C08L67/02 ,  H05K1/03 ,  C08K5/3415

CPC classification number: H01L23/293 ,  C08G63/547 ,  C08L67/02 ,  H01L23/29 ,  H05K1/0326 ,  C08K5/3415

Abstract: A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.

公开(公告)号：US11873356B2

公开(公告)日：2024-01-16

申请号：US17041776

申请日：2019-03-14

Applicant: DIC Corporation

Inventor： Kazuhisa Yamoto ,  Yutaka Satou ,  Koji Hayashi

IPC: C08G73/10 ,  C08F212/14 ,  H01L23/29 ,  H05K1/03

CPC classification number: C08F212/22 ,  C08G73/10 ,  H01L23/29 ,  H05K1/03

Abstract: A curable composition to be cured to a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film. There is a curable composition containing an aromatic ester compound (A) and a maleimide compound (B), the aromatic ester compound (A) being represented by structural formula (1) (where in the formula, Ar1 is a substituted or unsubstituted aromatic ring group, each R1 is a polymerizable unsaturated bond-containing substituent, each 1 is 0 or 1, each R2 is any of an alkyl group, an alkoxy group, an alkyloxycarbonyl group, an alkylcarbonyloxy group, and a halogen atom, each m is 0 or an integer of 1 to 5, and n is 2 or 3, provided that at least one polymerizable unsaturated bond-containing substituent is contained in one molecule as a substituent on Ar1 or as R1).

公开(公告)号：US11548977B2

公开(公告)日：2023-01-10

申请号：US16623456

申请日：2018-04-24

Applicant: DIC Corporation

Inventor： Yutaka Satou ,  Kazuhisa Yamoto ,  Koji Hayashi

IPC: C08G59/42 ,  C08G63/00 ,  H01L23/29 ,  H05K1/03

Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.

公开(公告)号：US20210032383A1

公开(公告)日：2021-02-04

申请号：US17041776

申请日：2019-03-14

Applicant: DIC Corporation

Inventor： Kazuhisa Yamoto ,  Yutaka Satou ,  Koji Hayashi

IPC: C08F212/14 ,  C08G73/10 ,  H05K1/03 ,  H01L23/29

Abstract: A curable composition to be cured to a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film. There is a curable composition containing an aromatic ester compound (A) and a maleimide compound (B), the aromatic ester compound (A) being represented by structural formula (1) (where in the formula, Ar1 is a substituted or unsubstituted aromatic ring group, each R1 is a polymerizable unsaturated bond-containing substituent, each 1 is 0 or 1, each R2 is any of an alkyl group, an alkoxy group, an alkyloxycarbonyl group, an alkylcarbonyloxy group, and a halogen atom, each m is 0 or an integer of 1 to 5, and n is 2 or 3, provided that at least one polymerizable unsaturated bond-containing substituent is contained in one molecule as a substituent on Ar1 or as R1).