公开(公告)号：US20240287315A1

公开(公告)日：2024-08-29

申请号：US18570609

申请日：2022-06-09

Applicant: DIC Corporation

Inventor： Kenichirou OKA ,  Yasuhiro TAKADA

IPC: C09D5/00 ,  C08K3/36 ,  C09D143/04 ,  C09D151/10 ,  C23C14/02 ,  C23C14/10

CPC classification number: C09D5/002 ,  C09D143/04 ,  C09D151/10 ,  C23C14/021 ,  C23C14/10 ,  C08K3/36

Abstract: Provided are a primer composition for inorganic oxide containing a polysiloxane compound (A), a compound having a reactive group (B) that is not (A), and inorganic oxide fine particles (C), (A) having a vinyl group and/or an epoxy group, a structural unit represented by a formula (1) and/or a formula (2), and a silanol group and/or a hydrolyzable silyl group, wherein a content of (A) is 2.5 to 40 mass % relative to a sum of (A) to (C), a cured product obtained by curing the composition, and a multilayer body having a curable resin layer obtained by curing the composition (R1 to R3 are a group having a specific polymerizable double bond, or an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an epoxy group).

公开(公告)号：US20170253965A1

公开(公告)日：2017-09-07

申请号：US15523353

申请日：2015-10-29

Applicant: DIC Corporation

Inventor： Yasuhiro TAKADA ,  Takayuki MIKI ,  Naoto YAGI ,  Kenichiro OKA ,  Hideki TORII ,  Shinichi KUDO

IPC: C23C16/40 ,  C09J11/04 ,  C09D183/14 ,  C09D7/12 ,  C09J183/14 ,  C09D5/00

CPC classification number: C23C16/40 ,  B32B9/04 ,  B32B27/00 ,  B32B27/30 ,  C08G77/442 ,  C08J7/045 ,  C08J2369/00 ,  C08J2451/08 ,  C08J2483/10 ,  C08K3/36 ,  C09D5/002 ,  C09D7/61 ,  C09D183/14 ,  C09J11/04 ,  C09J183/14 ,  C23C16/401

Abstract: There is provided a layered body including a resin layer and a second layer that are stacked on one another. The resin layer is formed of a resin composition containing a fine inorganic particle composite that includes: a composite resin in which a polysiloxane segment having a structural unit represented by general formula and/or general formula and further having a silanol group and/or a hydrolyzable silyl group is bonded to a vinyl-based polymer segment through a bond represented by general formula; and fine inorganic particles that are each bonded to the composite resin at the polysiloxane segment through a siloxane bond.