公开(公告)号：US20230272180A1

公开(公告)日：2023-08-31

申请号：US18016087

申请日：2021-07-06

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Craig F. GORIN ,  David L. MALOTKY ,  Daniel L. DERMODY ,  Christopher J. TUCKER ,  Jin WANG ,  Anurima SINGH ,  Jill M. MARTIN ,  Thomas TOMCZAK ,  Hari KATEPALLI

IPC: C08J11/06 ,  B01D11/02 ,  B29B17/02 ,  B29B13/02

CPC classification number: C08J11/06 ,  B01D11/0226 ,  B01D11/0288 ,  B29B17/02 ,  B29B13/022 ,  C08J2323/06 ,  B29B2013/002

Abstract: A method for reducing an amount of a contaminant in a thermoplastic polymer comprising shearing a combination comprising a contaminated thermoplastic polymer in melt form, water, and a dispersing agent where the shearing causes a portion of the contaminant to be removed from the contaminated thermoplastic polymer (e.g. moved into an aqueous phase with the water or into another separate phase from the water and the polymer), and after shearing, separating the thermoplastic from the aqueous phase to recover thermoplastic polymer.

公开(公告)号：US20150118488A1

公开(公告)日：2015-04-30

申请号：US14069348

申请日：2013-10-31

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

Inventor： Zhifeng BAI ,  Mark S. OLIVER ,  Michael K. GALLAGHER ,  Christopher J. TUCKER ,  Karen R. BRANTL ,  Elissei IAGODKINE ,  Zidong WANG

IPC: H01L21/683 ,  C09J143/04

CPC classification number: C09J143/04 ,  B32B7/06 ,  B32B7/12 ,  C08K5/06 ,  C08L71/02 ,  C09J5/06 ,  C09J11/08 ,  C09J125/18 ,  C09J171/02 ,  C09J2471/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T428/2848

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Abstract translation: 含有粘合剂材料，脱模添加剂和增容剂的组合物适用于临时粘接两个表面，如晶片活性侧和基材。 这些组合物可用于制造其中期望将组分临时粘合到基底上的电子器件。

公开(公告)号：US20160297985A1

公开(公告)日：2016-10-13

申请号：US15055987

申请日：2016-02-29

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

Inventor： Zhifeng BAI ,  Michael K. GALLAGHER ,  Zidong WANG ,  Christopher J. TUCKER ,  Matthew T. BISHOP ,  Elissei IAGODKINE ,  Mark S. OLIVER

IPC: C09D143/04 ,  C09D7/12 ,  B05D3/00 ,  C09D5/00

CPC classification number: C09D143/04 ,  B05D3/007 ,  B05D3/10 ,  C08G61/02 ,  C08G61/12 ,  C08G2261/3424 ,  C08G2261/344 ,  C08G2261/65 ,  C08L25/10 ,  C08L25/16 ,  C08L27/06 ,  C08L51/04 ,  C08L51/06 ,  C08L51/08 ,  C08L63/00 ,  C08L71/02 ,  C09D5/00 ,  C09D7/65 ,  C09J165/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H05K3/285 ,  C08L65/00

Abstract: Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

Abstract translation: 提供具有改善的韧性的芳族环烯烃聚合物。 还提供了具有改善的韧性的用于涂覆芳基环丁烯聚合物的组合物和方法。

公开(公告)号：US20160122601A1

公开(公告)日：2016-05-05

申请号：US14992251

申请日：2016-01-11

Applicant: Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

Inventor： Zhifeng BAI ,  Mark S. OLIVER ,  Michael K. GALLAGHER ,  Christopher J. TUCKER ,  Karen R. BRANTL ,  Elissei IAGODKINE ,  Zidong WANG

IPC: C09J143/04 ,  B32B7/12 ,  H01L21/683 ,  B32B7/06 ,  C09J171/02 ,  C08K5/06

CPC classification number: C09J143/04 ,  B32B7/06 ,  B32B7/12 ,  C08K5/06 ,  C08L71/02 ,  C09J5/06 ,  C09J11/08 ,  C09J125/18 ,  C09J171/02 ,  C09J2471/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T428/2848

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.