公开(公告)号：US10458004B2

公开(公告)日：2019-10-29

申请号：US14918948

申请日：2015-10-21

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： Kozo Ogi ,  Kenichi Inoue ,  Atsushi Ebara ,  Akihiro Asano ,  Hideyuki Fujimoto ,  Takahiro Yamada

IPC: C22C12/00 ,  H05K1/09 ,  B22F1/00 ,  H01B1/22 ,  C22C5/06 ,  B22F9/08

Abstract: To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 μm to 10 μm, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.