公开(公告)号：US20150243400A1

公开(公告)日：2015-08-27

申请号：US14678665

申请日：2015-04-03

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： Shuji KANEDA ,  Kimikazu MOTOMURA ,  Tatsuya KARIYASU ,  Yutaka HISAEDA ,  Kosuke IHA

IPC: H01B1/02 ,  B22F1/00 ,  H01B1/16 ,  C22C5/08

CPC classification number: H01B1/02 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B22F1/0074 ,  B22F9/24 ,  B82Y30/00 ,  C01P2004/04 ,  C01P2004/64 ,  C01P2006/11 ,  C01P2006/12 ,  C09C1/62 ,  C09D5/24 ,  C09D17/006 ,  C22C5/06 ,  C22C5/08 ,  H01B1/16 ,  H01B1/22 ,  H01M4/38

Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.

Abstract translation: 提供了适合大规模生产具有均匀粒径的纳米颗粒的方法。 本发明的目的是提供通过该方法获得的纳米颗粒的粉末，含有纳米颗粒的分散体和含有纳米颗粒的糊剂。 提供了一种制造银粒子的方法，其包括相对于银量将含有由有机材料和铜成分组成的保护剂的银溶液中的银还原为银的步骤，以获得具有 使用透射电子显微镜测定的平均粒径（DTEM）为5〜100nm。

公开(公告)号：US20160172328A1

公开(公告)日：2016-06-16

申请号：US14966585

申请日：2015-12-11

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： Keiichi ENDOH ,  Yutaka HISAEDA ,  Akihiro MIYAZAWA ,  Aiko NAGAHARA ,  Toshihiko UEYAMA

IPC: H01L23/00 ,  B23K35/30 ,  B23K1/00

CPC classification number: H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2101/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/3512

Abstract: A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.

Abstract translation: 接合两种不同物质的方法包括以下步骤：将包含含有至少两个羧基的有机材料的助熔剂成分的接合材料施加到接合物的接合表面，将待接合物体设置在接合材料上 在设置待接合物体的状态下，在预设温度下进行预烧，并且在比预热的温度高的温度下进行加热。

公开(公告)号：US20160099087A1

公开(公告)日：2016-04-07

申请号：US14966598

申请日：2015-12-11

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： Keiichi ENDOH ,  Yutaka HISAEDA ,  Akihiro MIYAZAWA ,  Aiko NAGAHARA ,  Toshihiko UEYAMA

IPC: H01B1/02 ,  B23K35/30 ,  B23K35/02 ,  H01L23/00 ,  B23K1/00

CPC classification number: H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2101/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/3512

Abstract: A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250° C. for 10 minutes in an inert atmosphere is 65 nm or larger.

Abstract translation: 通过涂布含有平均一次粒径为1〜200nm的银纳米粒子的银膏，进行烧成，得到粘合体。 在惰性气氛中在250℃加热10分钟时，Ag的（111）面上的结合产物的微晶直径为65nm以上。