公开(公告)号：US20250012489A1

公开(公告)日：2025-01-09

申请号：US18712375

申请日：2023-01-31

Applicant: Danfoss A/S

Inventor： Sushank THOTAKOORI ,  Marius DRAGUT ,  Lin Xiang SUN ,  Brandon Keith PRITCHARD ,  Wenchao CAO ,  Ruiguo GAO ,  Joshua David FLESCH

IPC: F25B31/00 ,  B33Y10/00 ,  F25B49/02

Abstract: A housing for a refrigerant compressor may include a first portion made of a metallic material and surrounding moving parts of the refrigerant compressor. The housing may further include a second portion mounted to the first portion and surrounding non-moving, electronic parts of the refrigerant compressor. The second portion is made of a plastic material.

公开(公告)号：US20230087561A1

公开(公告)日：2023-03-23

申请号：US17795358

申请日：2021-03-16

Applicant: DANFOSS A/S

Inventor： Lin Xiang SUN ,  Tianlei LI ,  Brandon Keith PRITCHARD

IPC: F25B31/00 ,  F04B39/06 ,  F25B41/20 ,  F25B5/02 ,  H02K11/33 ,  H02P1/28 ,  H02P1/52 ,  F04B35/04 ,  F25B1/053 ,  F25B1/10

Abstract: This disclosure relates to refrigerant compressors, and, in particular, relates to cooling for the power electronics of such compressors. An example refrigerant system includes a main refrigerant loop in communication with a condenser, an evaporator, and a compressor. The refrigerant system further includes at least one cooling line configured to direct refrigerant from the main refrigerant loop to cool a chamber containing electronic components. A method is also disclosed.