ULTRASOUND INTERCONNECT STACK AND METHOD OF MANUFACTURING SAME

    公开(公告)号:US20240416386A1

    公开(公告)日:2024-12-19

    申请号:US18702816

    申请日:2022-12-15

    Abstract: An acoustic device and method of manufacturing same. The device may be used to inspect tubulars and parts with high resolution. The acoustic device may include a 2D ultrasonic transducer layer and an ASIC connected to each other by an array of conductive wires. A non-conductive, acoustic damping material is flowed and set around the wires. to form a thick acoustic backing layer. Manufacturing the ultrasonic transducer may involve wire bonding. Electrical Discharge Machining or supporting rigid posts on a substrate. A surface of the backing layer may be machined. plated and diced to create conductive pads to connect the transducer layer to the wires then to the ASIC.

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