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公开(公告)号:US11254843B2
公开(公告)日:2022-02-22
申请号:US16971700
申请日:2019-01-22
Applicant: DOW TORAY CO., LTD.
Inventor: Takakazu Hino , Akihiro Nakamura , Michitaka Suto , Hidefumi Tanaka
Abstract: Disclosed is an adhesive film. The adhesive film has a silicone adhesive layer on one surface or both surfaces of a substrate film. A silicone adhesive material is used to form the silicone adhesive layer. The silicone adhesive material has 120 to 380% of an elongation at break (tensile speed of 300 mm/min, temperature of 25° C.) specified in JIS K 6251, and 1.8×105 to 4.5×105 Pa of a shear storage modulus (frequency of 10 Hz, temperature of 25° C.). The adhesive film generally has good wettability to the surface of an adherend and in general can be easily attached without creating air bubbles, to the extent that, even if air bubbles are created, the air bubbles can be easily dissipated. Further, even though the adhesive film is generally not easily peeled, peeling is generally possible with a small adhesive force during high speed peeling.
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公开(公告)号:US12134717B2
公开(公告)日:2024-11-05
申请号:US17285744
申请日:2019-10-15
Applicant: DOW TORAY CO., LTD.
Inventor: Makoto Yoshitake , Atsushi Sugie , Takuya Ogawa , Michitaka Suto , Haruhiko Furukawa
Abstract: Provided is a curable silicone composition, a cured product thereof, a laminate body, a manufacturing method thereof, and an optical device or optical display exhibiting excellent performance for use as a member where transparency is required such as for an optical display, a touch panel, or the like. A curable silicone composition, comprises: (A) an organopolysiloxane having in a molecule at least 2 alkenyl groups with 2 to 12 carbon atoms; (B) an organohydrogenpolysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule; and (C) a hydrosilylation reaction catalyst. Component (B) is present in an amount such that the silicon-bonded hydrogen atoms in component (B) are 0.5 to 2 mol per mol of aliphatic unsaturated carbon-carbon bonds in component (A), and 2 to 17.5 mol % of the silicon-bonded organic groups in the curable silicone composition are aryl groups.
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3.
公开(公告)号:US11987731B2
公开(公告)日:2024-05-21
申请号:US17267351
申请日:2019-08-13
Applicant: DOW TORAY CO., LTD.
Inventor: Maki Itoh , Akihiro Nakamura , Michitaka Suto
IPC: C09J183/04 , B32B7/06 , B32B7/12 , B32B27/08 , C08G77/00 , C08G77/08 , C08G77/16 , C08G77/20 , C08G77/22 , C09J7/38
CPC classification number: C09J183/04 , B32B7/06 , B32B7/12 , B32B27/08 , C08G77/08 , C08G77/16 , C08G77/20 , C08G77/22 , C08G77/80 , C09J7/38 , B32B2457/20 , C09J2203/326 , C09J2301/162 , C09J2301/302
Abstract: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a low storage elastic modulus (G′), excellent curability, and sufficient adhesion, along with applications thereof. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin wherein the weight average molecular weight (Mw) thereof is less than 4500 and the sum of the content of hydroxyl groups, etc. is 9 mole % or less; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst; and optionally, (A′) a chain organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule. The mass ratio of the organopolysiloxane resin (B) to the chain organopolysiloxane (A) is within a specific range and the shear storage elastic modulus G′ at −20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 1.0 MPa.
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4.
公开(公告)号:US12173197B2
公开(公告)日:2024-12-24
申请号:US17267367
申请日:2019-08-13
Applicant: DOW TORAY CO., LTD.
Inventor: Maki Itoh , Akihiro Nakamura , Michitaka Suto
IPC: C09J183/06 , B01J23/42 , C09J7/38 , H04R31/00
Abstract: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a relatively low storage elastic modulus (G′) at low temperatures, excellent curability, and sufficient adhesion for practical use. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin which has a content of 9 moles or less of hydroxyl groups and the like is a mixture of (b1) an organopolysiloxane resin having a weight average molecular weight (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a Mw of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. The mass ratio of component (B) to component (A) is within a range of 0.9 to 2.0, and the shear storage elastic modulus G′ at −20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 0.75 MPa.
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公开(公告)号:US12037525B2
公开(公告)日:2024-07-16
申请号:US17418391
申请日:2019-12-27
Applicant: Dow Toray Co., Ltd.
Inventor: Michitaka Suto , Tadashi Okawa , Satoshi Onodera , Hidefumi Tanaka , Haruhiko Furukawa
CPC classification number: C09J7/401 , C09J7/38 , C09J2483/00 , C09J2483/005
Abstract: Provided is a curable silicone composition for a release agent which can form a release film having a silicone adhesive with a low release force even when thin and which does not reduce the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. Also provided is a release film, laminate, and method of manufacture. The curable silicone composition comprises: (A) a fluorine-containing organopolysiloxane mixture obtained by mixing the following components (A1) and (A2) at a mass ratio of 1/99 to 99/1; (A1) a fluoro(poly)ether modified organopolysiloxane having at least two alkenyl groups per molecule along with a fluoro(poly)ether-containing organic group; (A2) a fluoroalkyl group-containing organopolysiloxane having at least two alkenyl groups per molecule along with a fluoroalkyl group represented by C4F9—CH2CH2—; (B) an organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation reaction catalyst; and (D) an organic solvent.
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公开(公告)号:US11981776B2
公开(公告)日:2024-05-14
申请号:US17285730
申请日:2019-10-15
Applicant: DOW TORAY CO., LTD.
Inventor: Atsushi Sugie , Takuya Ogawa , Michitaka Suto , Makoto Yoshitake , Haruhiko Furukawa
IPC: C08G77/12 , C08G77/08 , G02B1/04 , G02F1/1333 , G02F1/13357
CPC classification number: C08G77/12 , C08G77/08 , G02B1/04 , G02F1/13338 , G02F1/133602
Abstract: Provided is: a resin sheet having excellent characteristics as an optical member and exhibiting excellent performance when used in a light emitting device or the like; and a manufacturing method thereof. A curable silicone composition, comprises: (A) (a1) a straight chain or partially branched organopolysiloxane having an alkenyl group, and (a2) an organopolysiloxane having an alkenyl group, including an organopolysiloxane resin having an alkenyl group, comprising a certain amount of branched siloxane units; (B) (b1) a straight chain or partially branched organohydrogenpolysiloxane having a silicon-bonded hydrogen atom at an end of a molecular chain, (b2) an organohydrogenpolysiloxane, including a organohydrogenpolysiloxane resin, having a certain amount of branched siloxane units; and (C) a hydrosilylation reaction catalyst.
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公开(公告)号:US11680194B2
公开(公告)日:2023-06-20
申请号:US16606556
申请日:2018-04-13
Applicant: DOW TORAY CO., LTD.
Inventor: Takakazu Hino , Michitaka Suto , Akihiro Nakamura
IPC: C09J183/04 , C09J7/25 , C08G77/08 , C08G77/12 , C08G77/20
CPC classification number: C09J183/04 , C08G77/08 , C08G77/12 , C08G77/20 , C09J7/255 , C09J2203/318 , C09J2301/122 , C09J2301/208 , C09J2467/005 , C09J2483/00
Abstract: A method for producing a silicone-based adhesive is disclosed. The method comprises: (1) applying a silicone composition (I) to one surface of a peelable substrate, and then forming a silicone layer (I) by curing or drying the silicone composition (I); and (2) applying a silicone composition (II) to a surface of the silicone layer (I), and then forming the silicone-based adhesive by curing the silicone composition (II). The silicone composition (I) contains a silicone resin. The silicone composition (II) either does not contain the silicone resin or if contained, its content amount is lower than that in the silicone composition (I). The method is useful for producing a silicone-based adhesive with low peel resistance from a peelable substrate even with a low modulus.
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公开(公告)号:US12129379B2
公开(公告)日:2024-10-29
申请号:US17418394
申请日:2019-12-27
Applicant: Dow Toray Co., Ltd.
Inventor: Michitaka Suto , Tadashi Okawa , Satoshi Onodera , Hidefumi Tanaka , Haruhiko Furukawa
CPC classification number: C08L83/08 , C08G77/08 , C08G77/12 , C08G77/20 , C08G77/24 , C08G77/46 , C09J7/401 , C08L2201/10 , C08L2203/16 , C08L2205/025 , C08L2205/03 , C09J2301/162 , C09J2483/005
Abstract: Provided is a curable silicone composition for a release agent which can form a release film having a silicone adhesive with a low release force even when thin and which does not reduce the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. A release film and laminate are also provided. The curable silicone composition comprises: (A) a fluorine-containing organopolysiloxane mixture obtained by mixing the following components (A1) and (A2) at a mass ratio of 1/99 to 45/55: (A1) a fluoro(poly)ether modified organopolysiloxane having at least two alkenyl groups per molecule along with a fluoro(poly)ether-containing organic group; (A2) a fluoroalkyl group-containing organopolysiloxane having at least two alkenyl groups per molecule along with a fluoroalkyl group having 1 to 12 carbon atoms; (B) an organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation reaction catalyst; and (D) an organic solvent.
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公开(公告)号:US11053417B2
公开(公告)日:2021-07-06
申请号:US16490284
申请日:2018-02-28
Applicant: DOW TORAY CO., LTD.
Inventor: Takuya Ogawa , Haruna Mizuno , Atsushi Sugie , Makoto Yoshitake , Michitaka Suto
Abstract: Disclosed is a curable silicone composition. The composition comprises: (A) an organopolysiloxane having at least two alkenyl groups and at least one aryl group in each molecule; (B) a polyoxyalkylene compound represented by the general formula: XO—(C2H4O)p(CnH2nO)q(YO)r—X, wherein, each X represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an acryl group, or a methacryl group, provided that at least one X in each molecule is the alkenyl group, the acryl group, or the methacryl group, Y represents a divalent hydrocarbon group, n represents an integer of 3 to 6, p and q are integers satisfying: 2≤p≤100 and 0≤q≤50, and r represents 0 or 1; (C) an organopolysiloxane having at least two silicon bonded hydrogen atoms in each molecule; and (D) a catalyst for a hydrosilylation reaction. The composition forms a cured product having improved properties.
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