公开(公告)号：US20170266779A1

公开(公告)日：2017-09-21

申请号：US15458513

申请日：2017-03-14

Applicant: EBARA CORPORATION

Inventor： Shintaro ISONO ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Shingo TOGASHI ,  Satoru YAMAKI

IPC: B24B37/04 ,  B24B37/32 ,  B24B37/20

CPC classification number: B24B37/042 ,  B24B37/20 ,  B24B37/32

Abstract: According to one embodiment, a substrate polishing method includes: conveying a substrate to a position above a polishing pad by sucking the substrate by a first region of an elastic film; polishing the substrate while bringing the substrate into contact with the polishing pad; and lifting off the substrate by sucking the substrate by a second region of the elastic film, the second region being larger than the first region.

公开(公告)号：US20130324012A1

公开(公告)日：2013-12-05

申请号：US13905763

申请日：2013-05-30

Applicant: Ebara Corporation

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI

IPC: B24B37/005 ,  B24B7/22 ,  B24B37/04 ,  B24B37/07 ,  B24B37/32

CPC classification number: B24B37/005 ,  B24B7/228 ,  B24B37/042 ,  B24B37/07 ,  B24B37/32 ,  B24B49/16

Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.

Abstract translation: 抛光装置通过使基板与抛光表面滑动接触来抛光基板。 抛光装置包括：基板保持器，其具有被配置为将基板压靠在抛光表面上的基板保持表面;保持环，其联接到基板保持表面并且构造成围绕基板，其中保持环与抛光接触 所述保持环被构造成可以独立于所述基板保持表面倾斜; 旋转机构，其构造成使所述衬底保持器围绕其自身的轴线旋转; 以及至少一个局部负载施加机构，其被构造成沿与所述抛光表面垂直的方向在所述保持环的一部分上施加局部负载，所述至少一个局部负载施加机构被布置成不依照所述衬底移动 持有人

公开(公告)号：US20170144267A1

公开(公告)日：2017-05-25

申请号：US15402703

申请日：2017-01-10

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI ,  Shintaro ISONO

IPC: B24B37/30

CPC classification number: B24B37/30

Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion, The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.

公开(公告)号：US20150093971A1

公开(公告)日：2015-04-02

申请号：US14563383

申请日：2014-12-08

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Satoru YAMAKI

IPC: B24B37/10 ,  H01L21/683 ,  H01L21/67

CPC classification number: B24B37/005 ,  B24B37/015 ,  B24B37/10 ,  B24B37/30 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/6838

Abstract: A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to forma substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.

Abstract translation: 抛光用于将诸如半导体晶片的基板抛光到平面镜面。 抛光装置包括具有抛光表面的抛光台，配置成保持基板并将基板压靠在抛光表面上的基板保持装置和控制器。 基板保持装置包括：弹性膜，其构成为形成与基板接触的基板保持面，设置在弹性膜上方的载体，形成在弹性膜与载体之间的至少一个压力室，以及红外光检测器 被配置为测量来自弹性膜的热能。 控制器使用红外光检测器的测量值来计算弹性膜的温度的估计值。

公开(公告)号：US20240253181A1

公开(公告)日：2024-08-01

申请号：US18565046

申请日：2022-05-31

Applicant: EBARA CORPORATION

Inventor： Satoru YAMAKI ,  Keita YAGI ,  Nachiketa CHAUHAN ,  Akira NAKAMURA

IPC: B24B49/05 ,  B24B49/03 ,  B24B49/16

CPC classification number: B24B49/05 ,  B24B49/03 ,  B24B49/16

Abstract: The present invention relates to a technique of calculating a responsiveness of a polishing rate to change in a pressure to press a workpiece, such as a wafer, a substrate, or a panel, for use in manufacturing of semiconductor devices, against a polishing pad. A method includes: performing simulation to calculate a pressing-pressure responsiveness profile indicating a distribution of pressing pressure, which is to be applied from the workpiece to a polishing pad (2), changed in response to a change in unit pressure in the pressure chamber of a polishing head (7); pressing the workpiece against the polishing pad to polish the workpiece, while a predetermined pressure is maintained in the pressure chamber; creating a polishing-rate profile indicating a distribution of polishing rate of the polished workpiece; and creating the polishing-rate responsiveness profile based on the pressing-pressure responsiveness profile, the predetermined pressure, and the polishing-rate profile.

公开(公告)号：US20240198480A1

公开(公告)日：2024-06-20

申请号：US18519827

申请日：2023-11-27

Applicant: EBARA CORPORATION

Inventor： Satoru YAMAKI ,  Keita YAGI ,  Akira NAKAMURA ,  Kodai SHIRAKAWA

IPC: B24B49/05 ,  B24B49/16

CPC classification number: B24B49/05 ,  B24B49/16

Abstract: A method capable of accurately obtaining polishing-rate responsiveness to a change in pressure for pressing a workpiece, such as a wafer, against a polishing pad is disclosed. The method includes: creating an estimated polishing-rate responsiveness profile using simulation, the estimated polishing-rate responsiveness profile indicating a distribution of polishing-rate responsiveness to pressure change in the first pressure chamber; creating an actual polishing-rate responsiveness profile using polishing results of a workpiece, the actual polishing-rate responsiveness profile indicating a distribution of polishing-rate responsiveness to pressure change in the second pressure chamber, and creating a hybrid polishing-rate responsiveness profile by combining the estimated polishing-rate responsiveness profile and the actual polishing-rate responsiveness profile.

公开(公告)号：US20180117730A1

公开(公告)日：2018-05-03

申请号：US15790733

申请日：2017-10-23

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA ,  Makoto FUKUSHIMA ,  Keisuke NAMIKI ,  Shingo TOGASHI ,  Satoru YAMAKI ,  Masahiko KISHIMOTO ,  Tomoko OWADA

IPC: B24B37/30

CPC classification number: B24B37/30 ,  B24B37/32

Abstract: A substrate holding apparatus which can adjust polishing profile precisely is disclosed. The substrate holding apparatus includes an elastic membrane that forms a plurality of pressure chambers for pressing a substrate, and a head body to which the elastic membrane is coupled. The elastic membrane includes a contact portion to be brought into contact with the substrate for pressing the substrate against a polishing pad, an edge circumferential wall extending upwardly from a peripheral edge of the contact portion, and a plurality of inner circumferential walls arranged radially inwardly of the edge circumferential wall and extending upwardly from the contact portion. At least two adjacent inner circumferential walls of the plurality of inner circumferential walls include slope circumferential walls inclined radially inwardly. The slope circumferential walls are inclined radially inwardly in their entirety from their lower ends to upper ends, and extend upwardly.

公开(公告)号：US20170173756A1

公开(公告)日：2017-06-22

申请号：US15378761

申请日：2016-12-14

Applicant: EBARA CORPORATION

Inventor： Satoru YAMAKI ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Shingo TOGASHI ,  Shintaro ISONO

IPC: B24B37/005 ,  B24B37/20

CPC classification number: B24B37/005 ,  B24B37/20

Abstract: A polishing object is prevented from slipping out without depending on the process type or the polishing condition. A polishing apparatus for polishing a surface to be polished of an polishing object by sliding the surface to be polished and a polishing member relative to each other, including: a pressing unit that presses a back surface of the surface to be polished of the polishing object such that the surface to be polished is pressed against the polishing member; a retainer member that is arranged on an outer side of the pressing unit and presses the polishing member; a storage unit that stores information concerning a condition for preventing the polishing object from slipping out, the condition being defined by use of information concerning a pressing force of the retainer member; and a control unit that acquires information concerning a force of friction between the surface to be polished of the polishing object and the polishing member or information concerning the pressing force of the retainer member, and executes control for adapting to the condition for preventing the slipping-out by using the acquired information concerning the force of friction or the acquired information concerning the pressing force of the retainer member.

公开(公告)号：US20180301367A1

公开(公告)日：2018-10-18

申请号：US15950989

申请日：2018-04-11

Applicant: EBARA CORPORATION

Inventor： Satoru YAMAKI ,  Makoto FUKUSHIMA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Tomoko OWADA ,  Yoshikazu KATO

IPC: H01L21/687 ,  B24B7/04

Abstract: An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.

公开(公告)号：US20150273657A1

公开(公告)日：2015-10-01

申请号：US14668844

申请日：2015-03-25

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI ,  Shintaro ISONO

IPC: B24B37/30

CPC classification number: B24B37/30

Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.

Abstract translation: 公开了一种能够精确地控制晶片边缘部分的狭窄区域中的抛光轮廓的弹性膜。 弹性膜包括与基板接触的接触部分; 从所述接触部分的周缘向上延伸的第一边缘周向壁; 以及第二边缘周壁，其具有连接到所述第一边缘周壁的内周表面的水平部分。 第一边缘周壁的内圆周表面包括两个垂直于接触部分的上内圆周表面和下内圆周表面。 上部内周面从第二边缘周壁的水平部分向上延伸，下部内圆周表面从水平部分向下延伸。