PAD-TEMPERATURE REGULATING APPARATUS, PAD-TEMPERATURE REGULATING METHOD, AND POLISHING APPARATUS

    公开(公告)号:US20210347004A1

    公开(公告)日:2021-11-11

    申请号:US17242886

    申请日:2021-04-28

    Abstract: A pad-temperature regulating device is disclosed, which can improve a responsiveness of a control for a surface temperature of a polishing pad and regulate the surface temperature of the polishing pad without causing defects, such as scratches, on the substrate. The pad-temperature regulating apparatus includes: a heat exchanger disposed above the polishing pad, whose temperature is maintained at a predetermined temperature; a pad-temperature measuring device configured to measure the surface temperature of the polishing pad; a distance sensor configured to measure a separation distance between the polishing pad and the heat exchanger; an elevating mechanism for moving the heat exchanger vertically with respect to the polishing pad; and a controller configured to control operation of the elevating mechanism based on measured values of the pad-temperature measuring device.

    CLEANING MEMBER ATTACHING PART, CLEANING MEMBER ASSEMBLY AND SUBSTRATE CLEANING APPARATUS

    公开(公告)号:US20200276619A1

    公开(公告)日:2020-09-03

    申请号:US16750859

    申请日:2020-01-23

    Abstract: In one embodiment of the present invention, a cleaning member 90 is attached to the surface of a cleaning member attaching part 10. The cleaning member attaching part 10 has a main body 20, a cleaning liquid introduction part 30 extending inside the main body 20, and a plurality of cleaning liquid supply holes 40 communicating with the cleaning liquid introduction part 30. The cleaning liquid introduction part 30 is configured such that cleaning liquid flows in from a first end part 11 side, and an area proportion of the cleaning liquid supply holes 40 in a second region located on a second end part 12 side opposite to the first end part 11 to a surface of the main body 20 is larger than the area proportion of the cleaning liquid supply holes 40 in a first region located on the first end part 11 side to the surface of the main body 20.

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