公开(公告)号：US20240018312A1

公开(公告)日：2024-01-18

申请号：US18250250

申请日：2021-10-27

Applicant: ENEOS Corporation

Inventor： Ryoto KAWAMURA ,  Ayaka SEICHI

IPC: C08J3/20 ,  C09K19/38 ,  C09J133/08 ,  C08K3/26 ,  C08J7/043 ,  C09J163/00 ,  C08K3/013

CPC classification number: C08J3/201 ,  C09K19/3809 ,  C09J133/08 ,  C08K3/26 ,  C08J7/043 ,  C09J163/00 ,  C08K3/013 ,  C08J2481/06 ,  C08J2467/03

Abstract: The invention provides a method for enhancing adhesion strength to an adhesive without any loss of mechanical strength of a resin molded article. In particular, the invention provides a method for enhancing adhesion strength of a resin molded article made of a resin composition including a liquid crystal polymer resin and an inorganic filling agent, to an adhesive, in which an amorphous resin is further compounded into the resin composition, and an amount of compounding of the liquid crystal polymer resin, an amount of compounding of the amorphous resin, and an amount of compounding of the inorganic filling agent are respectively regulated to 50-99 parts by mass, 1-50 parts by mass, and 0.1-120 parts by mass, based on 100 parts by mass in total of the liquid crystal polymer resin and the amorphous resin.