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    METAL CLAD LAMINATE, PREPARATION METHOD THEREOF, AND METHOD FOR PREPARING FLEXIBLE CIRCUIT BOARD BY USING THE SAME
    3.
    发明申请
    METAL CLAD LAMINATE, PREPARATION METHOD THEREOF, AND METHOD FOR PREPARING FLEXIBLE CIRCUIT BOARD BY USING THE SAME 审中-公开
    金属层压板，其制备方法和使用它制备柔性电路板的方法

    公开(公告)号：US20160374208A1

    公开(公告)日：2016-12-22

    申请号：US15185946

    申请日：2016-06-17

    Applicant: ETERNAL MATERIALS CO., LTD.

    Inventor： Shun-Jen CHIANG ,  Chung-Jen WU ,  Meng-Yen CHOU

    IPC: H05K3/10 ,  H05K3/00 ,  C09D179/08

    CPC classification number: H05K3/0097 ,  C09D179/08 ,  H05K1/0326 ,  H05K1/0346 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2203/0143 ,  H05K2203/1545

    Abstract: The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.

    Abstract translation: 本公开内容提供一种金属包覆层压板，其制备方法和使用该柔性电路板的方法。 本公开的覆金属层压板包括第一金属箔，直接设置在第一金属箔上的第一聚酰亚胺层，第二金属箔和直接设置在第二金属箔上的第二聚酰亚胺层，第一聚酰亚胺层位于 与第二聚酰亚胺层接触。 本公开的金属包覆层压板相当于结构上的双面柔性覆铜层压板（FCCL），在减少翘曲方面在机械性能方面优于单面FCCL，并且具有用于 电路制造同时在其两侧。

    POLYIMIDE DRY FILM AND APPLICATION THEREOF
    4.
    发明申请
    POLYIMIDE DRY FILM AND APPLICATION THEREOF 审中-公开

    公开(公告)号：US20180002567A1

    公开(公告)日：2018-01-04

    申请号：US15636993

    申请日：2017-06-29

    Applicant: ETERNAL MATERIALS CO., LTD.

    Inventor： Po-Yu HUANG ,  Chih-Min AN ,  Chung-Jen WU ,  Meng-Yen CHOU ,  Chang-Hong HO ,  Shun-Jen CHIANG ,  Chung-Kai CHENG

    IPC: C09D179/08 ,  C08J5/18 ,  H05K3/28 ,  C08G73/10 ,  C08G73/12

    Abstract: A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.

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